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NCP4682DSN30T1G

Onsemi

NCP4682DSN30T1G by Onsemi

NCP4682DSN30T1G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3V and max dropout voltage of 0.32V. It operates in temperatures ranging from -40 to 150°C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 2,898 parts In-Stock

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Digiode

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 821 parts In-Stock

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$12.202

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Ampacity Inc.

Singapore . 189 parts In-Stock

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$19.500

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A-Z Elektronik GmbH

Germany . 5,375 parts In-Stock

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TANS Electronics

Latvia . 3,973 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

Mexico . 2,963 parts In-Stock

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Continental Prestige Electronics

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 884 parts In-Stock

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Corphita

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Argo Parts USA

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Microchip USA

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Corohmni

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Bastille Electronics

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Overview

Unlock the potential of your electronic devices with the NCP4682DSN30T1G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This fixed regulator offers seamless performance for a wide range of applications, ensuring stable and efficient power supply. With precise output voltage control and minimal dropout voltage, this product delivers unmatched value and convenience to customers. Upgrade your electronics today with the NCP4682DSN30T1G and experience the difference in performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the safety of the regulator.

Maximum Dropout Voltage: 1.32 V

The low dropout voltage ensures efficient regulation even with small input-output differentials.

Surface Mount: YES

Allows for easy and quick assembly on circuit boards, making it ideal for small electronic devices.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption and reliable performance.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into various electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support for reliable connections.

Operating Temperature (TJ-Min): -40 °C

With a low minimum operating temperature, this regulator can function in cold environments.

Packing Method: TR

Tape and reel packaging offers convenience and protection during shipping and handling.

Minimum Output Voltage: 2.955 V

Provides a stable output voltage for sensitive electronic components.

Maximum Voltage Tolerance: 1.5%

Ensures precise voltage regulation for consistent performance of connected devices.

Nominal Output Voltage: 3 V

The standard output voltage meets the requirements of many electronic applications.

No. of Terminals: 5

Provides multiple connection points for versatile integration into circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This compact package design saves space and allows for efficient PCB layout.

Adjustability: FIXED

The fixed output voltage eliminates the need for external adjustments, simplifying the design process.

Terminal Pitch: 0.95 mm

The tight terminal pitch enables high-density mounting for space-constrained applications.

Maximum Line Regulation: 0.0045%

Maintains stable output voltage even with fluctuating input voltages.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Provides stable and accurate voltage regulation for consistent device performance.

Terminal Finish: TIN

Tin finish offers good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB layout and component mounting.

Maximum Output Voltage: 3.045 V

Provides a precise output voltage for devices that require tight voltage tolerances.

Maximum Seated Height: 1.45 mm

Low profile design allows for compact and slim device designs.

Width: 1.65 mm

Compact width for space-efficient mounting on circuit boards.

Maximum Load Regulation: 0.02%

Ensures stable performance even with varying loads.

Minimum Input Voltage: 1.7 V

Can operate reliably even with low input voltages.

Maximum Output Current: 0.15 A

Supports moderate output current for powering various components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for safe and reliable soldering.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the reflow soldering process.

Nominal Dropout Voltage: 0.24 V

Provides efficient regulation with minimal voltage drop across the regulator.

Length: 2.9 mm

Compact length for space-saving integration into electronic designs.

Maximum Input Voltage: 5.25 V

Safely handles higher input voltages for versatile use in different applications.

Maximum Input Voltage Absolute: 6 V

Can tolerate brief voltage spikes above the maximum input voltage for added protection.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4682DSN30T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.24 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

1.7 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.0045 %

Maximum Load Regulation:

.02 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.045 V

Minimum Output Voltage-1:

2.955 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.65 mm

Trade Compliance

NCP4682DSN30T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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