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NCP4587DSN30T1G

Onsemi

NCP4587DSN30T1G by Onsemi

NCP4587DSN30T1G by Onsemi is a CMOS LDO regulator with 3V output voltage, 0.18V dropout voltage, and 0.15A output current. Ideal for applications requiring low-profile surface mount regulators in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,132 parts In-Stock

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Vyrian

USA . 1,154 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 620 parts In-Stock

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$8.849

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Ampacity Inc.

Singapore . 1,386 parts In-Stock

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$13.500

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TANS Electronics

Latvia . 7,642 parts In-Stock

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Problanco Electronics

Mexico . 7,139 parts In-Stock

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Kulean Microsystems

USA . 5,917 parts In-Stock

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Continental Prestige Electronics

USA . 4,960 parts In-Stock

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Argo Parts USA

USA . 4,878 parts In-Stock

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Lixinc

USA . 3,897 parts In-Stock

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Corphita

USA . 1,582 parts In-Stock

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SupplyDigital Components

Austria . 1,554 parts In-Stock

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Vigor

Singapore . 500 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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UHIMA Technologies

Türkiye . 343 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 58 parts In-Stock

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Overview

Discover the NCP4587DSN30T1G by Onsemi, a top-of-the-line Fixed Regulator with unmatched quality and reliability. Manufactured by industry leader Onsemi, this LDO regulator is ideal for a wide range of applications, offering stable output voltage and superior performance. With its compact design and advanced technology, the NCP4587DSN30T1G provides customers with reliable power management solutions that ensure optimal efficiency and performance. Upgrade your electronic devices today with the innovative NCP4587DSN30T1G and experience the difference in quality and value that Onsemi products deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a good choice for long-term use.

Maximum Dropout Voltage-1: 1.18 V

With a low dropout voltage, this regulator is efficient and minimizes power loss, making it ideal for energy-saving applications.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCB layouts, making it convenient for compact designs.

Operating Temperature (TJ-Max): 150 °C

With a high operating temperature range, this regulator can withstand harsh environmental conditions, making it versatile for various applications.

Technology: CMOS

The CMOS technology used in this regulator ensures low power consumption and high efficiency, making it a cost-effective and energy-efficient choice.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4587DSN30T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.18 V

Nominal Dropout Voltage-1:

.12 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.045 V

Minimum Output Voltage-1:

2.925 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

1.65 mm

Trade Compliance

NCP4587DSN30T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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