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NCP4680DSQ18T1G

Onsemi

NCP4680DSQ18T1G by Onsemi

NCP4680DSQ18T1G by Onsemi is a CMOS LDO regulator with 1.8V output voltage, 0.48V dropout voltage, and 0.15A output current. Ideal for applications requiring stable power supply in compact spaces due to its small outline package style and thin profile design.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,647 parts In-Stock

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Digiode

USA . 793 parts In-Stock

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AZTECH Wire

Italy . 814 parts In-Stock

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$8.700

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 9,677 parts In-Stock

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Kulean Microsystems

USA . 7,887 parts In-Stock

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SupplyDigital Components

Austria . 2,931 parts In-Stock

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Perfect Parts

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Corphita

USA . 1,137 parts In-Stock

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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Vigor

Singapore . 648 parts In-Stock

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Problanco Electronics

Mexico . 494 parts In-Stock

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Microchip USA

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TANS Electronics

Latvia . 140 parts In-Stock

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Overview

Unlock the power of reliable voltage regulation with the NCP4680DSQ18T1G by Onsemi. Designed with precision and quality in mind, this fixed LDO regulator offers unparalleled stability and efficiency for a wide range of applications. From consumer electronics to industrial equipment, this product ensures consistent performance and protection for your circuits. Trust in Onsemi's reputation for excellence and experience the value of seamless power management with the NCP4680DSQ18T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

Maximum Dropout Voltage-1: 1.48 V

Low dropout voltage allows the regulator to operate efficiently even with small input-output differentials.

Surface Mount: YES

Easy to integrate onto circuit boards, reducing assembly time and effort.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range allows for versatile use in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Package Shape: RECTANGULAR

Space-efficient design for compact applications.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections to the circuit.

Operating Temperature (TJ-Min): -40 °C

Ensures reliable operation even in extreme cold conditions.

Minimum Output Voltage-1: 1.773 V

Stable and accurate output voltage for precise regulation.

Maximum Voltage Tolerance: 1.5 %

High voltage tolerance ensures consistent performance under varying conditions.

Nominal Output Voltage-1: 1.8 V

Stable output voltage suitable for a wide range of applications.

No. of Terminals: 5

Sufficient terminals for proper connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design for space-constrained applications.

Terminal Pitch: 0.65 mm

Close terminal pitch for efficient board layout and assembly.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Regulates voltage to a fixed value with low dropout, suitable for various electronic devices.

Terminal Finish: TIN

Tin finish for reliable electrical conductivity.

Terminal Position: DUAL

Dual terminal positioning for secure mounting and connection.

Maximum Output Voltage-1: 2.815 V

High maximum output voltage for versatile use in different applications.

Maximum Seated Height: 1.1 mm

Low profile design for space-saving and compact integration.

Width: 1.25 mm

Narrow width for easy placement on circuit boards.

Minimum Input Voltage: 1.4 V

Low minimum input voltage for compatibility with various power sources.

Maximum Output Current-1: 0.15 A

Sufficient output current for powering a range of devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable soldering.

Nominal Dropout Voltage-1: 0.33 V

Low dropout voltage for efficient regulation and power management.

Length: 2 mm

Compact length for easy integration and space-saving.

Maximum Input Voltage: 5.25 V

High maximum input voltage tolerance for versatile input sources.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4680DSQ18T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.48 V

Nominal Dropout Voltage-1:

.33 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

2.815 V

Minimum Output Voltage-1:

1.773 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.25 mm

Trade Compliance

NCP4680DSQ18T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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