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NCP45523IMNTWG-L

Onsemi

NCP45523IMNTWG-L by Onsemi

NCP45523IMNTWG-L by Onsemi is a Power Management IC with 3.3V supply voltage, -40 to 85 °C operating temperature range, and 8 terminals in a small outline package. It is suitable for industrial applications requiring power supply support circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,217 parts In-Stock

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Digiode

USA . 226 parts In-Stock

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AZTECH Wire

Italy . 1,113 parts In-Stock

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$11.720

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Problanco Electronics

Mexico . 7,967 parts In-Stock

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SupplyDigital Components

Austria . 7,458 parts In-Stock

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Microchip USA

USA . 2,056 parts In-Stock

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TANS Electronics

Latvia . 1,619 parts In-Stock

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Kulean Microsystems

USA . 1,514 parts In-Stock

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Corphita

USA . 983 parts In-Stock

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UHIMA Technologies

Türkiye . 975 parts In-Stock

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Corohmni

South Africa . 323 parts In-Stock

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Overview

Enhance your power management capabilities with the NCP45523IMNTWG-L from Onsemi. Crafted with precision and quality in mind, this Power Management IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides efficient power supply support circuitry in a compact and durable package. Experience the value and benefits that only Onsemi can deliver, with a product designed to exceed your expectations. Elevate your projects with the NCP45523IMNTWG-L and unlock a new level of power management efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and secure mounting onto a PCB, saving space and ensuring reliable connections.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with common power sources, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance for reliable connections.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring long-term reliability.

Technical Specifications

Power Management ICs NCP45523IMNTWG-L attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NCP45523IMNTWG-L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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