Loading...

NCP360SNT3G

Onsemi

NCP360SNT3G by Onsemi

NCP360SNT3G by Onsemi is a 5-terminal peripheral driver with built-in transient, over current, and thermal protections. It operates b/w -40 to 85 °C with a supply voltage range of 1.2V to 20V. Ideal for industrial applications requiring a compact design and source output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,282

-

-

-

-

Digiode

USA . 734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

734

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,171

-

-

-

-

Problanco Electronics

Mexico . 4,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,971

-

-

-

-

TANS Electronics

Latvia . 3,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,091

-

-

-

-

Corphita

USA . 2,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

-

-

-

-

SupplyDigital Components

Austria . 1,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,042

-

-

-

-

UHIMA Technologies

Türkiye . 621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

621

-

-

-

-

Corohmni

South Africa . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147

-

-

-

-

Overview

Enhance your electronic designs with the high-quality NCP360SNT3G peripheral driver by Onsemi. Known for its reliability and durability, Onsemi products are trusted by professionals worldwide. The NCP360SNT3G is versatile, offering built-in protections against transient events, over current, and thermal issues. Its compact design and wide operating temperature range make it ideal for a variety of applications. Experience the value and benefits this product brings to your projects, ensuring smooth and efficient performance every time. Elevate your creations with Onsemi's NCP360SNT3G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body offers lightweight and durable construction, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage of 20V, this peripheral driver can handle a wide range of voltage inputs, providing flexibility in various electrical systems.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections for transient voltage spikes, overcurrent situations, and thermal events ensure the safety and reliability of the connected peripherals and the driver itself.

No. of Terminals: 5

The 5 terminals allow for easy and secure connections to external components, supporting the smooth operation of the peripheral driver.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package make this peripheral driver suitable for compact and space-constrained applications.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage requirement of 1.2V enables efficient power consumption and operation in low-voltage environments.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the peripheral driver can withstand harsh environmental conditions, making it suitable for industrial applications.

Output Current Flow Direction: SOURCE

The source output current flow direction indicates that the peripheral driver provides current to connected devices, ensuring proper functioning and performance.

Technical Specifications

Peripheral Drivers NCP360SNT3G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

NCP360SNT3G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19