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NCP3712ASNT1

Onsemi

NCP3712ASNT1 by Onsemi

NCP3712ASNT1 by Onsemi is a Peripheral Driver with 6 terminals, 12.5V power supply, and 0.3A max output current. It offers overvoltage protection and operates b/w -40 to 85 °C. Ideal for industrial applications requiring buffer or inverter-based peripheral drivers.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,151 parts In-Stock

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1,151

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Vyrian

USA . 404 parts In-Stock

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404

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,385 parts In-Stock

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8,385

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Kulean Microsystems

USA . 6,733 parts In-Stock

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6,733

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Problanco Electronics

Mexico . 5,498 parts In-Stock

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SupplyDigital Components

Austria . 3,922 parts In-Stock

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3,922

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Corphita

USA . 1,484 parts In-Stock

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1,484

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UHIMA Technologies

Türkiye . 672 parts In-Stock

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672

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Corohmni

South Africa . 435 parts In-Stock

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Overview

Enhance your electronic designs with the NCP3712ASNT1 by Onsemi, a top-tier manufacturer in the industry. This Peripheral Driver offers outstanding quality and built-in protections against overvoltage and transients. Ideal for a wide range of applications, this product delivers exceptional value with its reliable performance and robust design. Trust Onsemi to provide cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the NCP3712ASNT1 - innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the peripheral driver, making it suitable for various environments.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort.

Built-in Protections: OVER VOLTAGE; TRANSIENT

Ensures the peripheral driver is safeguarded against voltage spikes and transients, enhancing reliability and longevity.

Power Supplies (V): 12.5

Provides a stable power source for the peripheral driver to operate efficiently within its specified parameters.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving design that is ideal for applications where board space is limited.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring reliable performance under demanding conditions.

Technology: BIPOLAR

Utilizes bipolar technology for high-speed and precise signal amplification, making it suitable for driving peripheral devices.

Maximum Output Current: 0.3 A

Capable of delivering a sufficient amount of current to drive various peripherals effectively.

Technical Specifications

Peripheral Drivers NCP3712ASNT1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER VOLTAGE; TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

12.5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

12.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

NCP3712ASNT1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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