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NCP361XMUXXTBG

Onsemi

NCP361XMUXXTBG by Onsemi

NCP361XMUXXTBG by Onsemi is a Peripheral Driver with 6 terminals, operating voltage range of 1.2V to 20V, and built-in protections against transient, over current, and thermal issues. It comes in a square chip carrier package suitable for industrial applications requiring source output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,639 parts In-Stock

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Digiode

USA . 118 parts In-Stock

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118

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TANS Electronics

Latvia . 5,839 parts In-Stock

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Kulean Microsystems

USA . 5,657 parts In-Stock

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SupplyDigital Components

Austria . 3,507 parts In-Stock

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Problanco Electronics

Mexico . 928 parts In-Stock

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UHIMA Technologies

Türkiye . 912 parts In-Stock

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Corphita

USA . 461 parts In-Stock

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Corohmni

South Africa . 71 parts In-Stock

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Overview

Enhance your electronic designs with the NCP361XMUXXTBG by Onsemi, a high-quality peripheral driver that offers reliable performance and built-in protections against transient events, overcurrent, and thermal issues. Manufactured by Onsemi, a trusted name in the industry, this chip carrier is perfect for a variety of applications in industrial settings. With a wide operating temperature range and a low supply voltage requirement, this product provides exceptional value and benefits to customers looking for a versatile and efficient solution for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the peripheral driver, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on a PCB, saving space and simplifying the assembly process.

Maximum Supply Voltage: 20 V

Provides flexibility in power supply options and can handle higher voltage inputs without risk of damage.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Ensures the safety of the peripheral driver and connected devices by preventing damage from voltage spikes, overcurrent situations, and overheating.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components or devices, allowing for versatile integration in different systems.

Width: 2mm

Compact size enables easy placement on a PCB and saves space in the overall design.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments, where temperature fluctuations and harsh conditions are common.

Nominal Supply Voltage: 5 V

Standard voltage requirement that is commonly available, making it compatible with a variety of power sources.

Terminal Pitch: 0.65 mm

Close terminal spacing allows for a higher density of connections, ideal for applications where space is limited.

Output Current Flow Direction: SOURCE

The direction of current flow is specified, making it easier to integrate into a circuit and ensuring proper functionality.

Technical Specifications

Peripheral Drivers NCP361XMUXXTBG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

S-PQCC-N6

Length:

2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

NCP361XMUXXTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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