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NCP2993FCT2G

Onsemi

NCP2993FCT2G by Onsemi

NCP2993FCT2G by Onsemi is an audio amplifier IC with 1.3W output power, operating at -40 to 85 °C. It features a very thin profile grid array package with 9 terminals for surface mount applications. Ideal for industrial use in audio and video amplification systems requiring a supply voltage of 2.5-5.5V.

Median Price

$0.378

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 249,676 parts In-Stock

1+ parts

-

100+ parts

$0.373

1k+ parts

$0.310

10k+ parts

$0.276

249,676

-

$0.373

$0.310

$0.276

Verical

USA . 189,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.384

10k+ parts

$0.342

189,676

-

-

$0.384

$0.342

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 260 parts In-Stock

1+ parts

$0.288

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-

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260

$0.288

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Vyrian

USA . 4,995 parts In-Stock

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4,995

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Distributors (Availability)

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Corphita

USA . 1,438 parts In-Stock

1+ parts

$0.273

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-

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1,438

$0.273

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Vigor

Singapore . 500 parts In-Stock

1+ parts

$0.290

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500

$0.290

-

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Corohmni

South Africa . 225 parts In-Stock

1+ parts

$0.300

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225

$0.300

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AZTECH Wire

Italy . 585 parts In-Stock

1+ parts

$15.490

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-

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585

$15.490

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Continental Prestige Electronics

USA . 249,676 parts In-Stock

1+ parts

-

100+ parts

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$0.275

10k+ parts

-

249,676

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-

$0.275

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Metaverse IC Inc.

Canada . 87,460 parts In-Stock

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87,460

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Problanco Electronics

Mexico . 8,240 parts In-Stock

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8,240

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TANS Electronics

Latvia . 7,944 parts In-Stock

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7,944

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QUARKTWIN TECHNOLOGY LTD

USA . 7,587 parts In-Stock

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7,587

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Kulean Microsystems

USA . 5,107 parts In-Stock

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Kepictronics

USA . 3,789 parts In-Stock

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3,789

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A-Z Elektronik GmbH

Germany . 2,624 parts In-Stock

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2,624

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SupplyDigital Components

Austria . 1,249 parts In-Stock

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1,249

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UHIMA Technologies

Türkiye . 895 parts In-Stock

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895

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Microchip USA

USA . 340 parts In-Stock

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340

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Overview

Experience crystal clear audio quality with the NCP2993FCT2G by Onsemi, a leading manufacturer in the industry. This audio amplifier is perfect for enhancing your audio and video applications, providing powerful sound output with a nominal power of 1.3W. Its compact design and industrial temperature grade make it suitable for a wide range of environments. Elevate your audio experience with this high-performance amplifier that offers exceptional value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and good heat dissipation, making the product reliable for long-term use.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Nominal Output Power: 1.3 W

Delivers sufficient power for audio amplification, suitable for various applications.

Nominal Bandwidth: 0.02 kHz

Provides clear and accurate audio reproduction across a wide frequency range.

Maximum Operating Temperature: 85 °C

Allows the amplifier to operate reliably even in elevated temperature environments.

Technical Specifications

Audio & Video Amplifiers NCP2993FCT2G attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PBGA-B9

Length:

1.22 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA9,3X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.22 mm

Trade Compliance

NCP2993FCT2G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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