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NC7WZ240K8X-L22236

Onsemi

NC7WZ240K8X-L22236 by Onsemi

The Onsemi NC7WZ240K8X-L22236 is a bus driver with 6ns propagation delay, suitable for industrial applications. It operates at 1.8V nominal voltage and has a max operating temperature of 85°C. With a small outline package style, it features dual terminal position and inverted output polarity.

Median Price

$0.123

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 6,000 parts In-Stock

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$0.123

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$0.123

Verical

USA . 6,000 parts In-Stock

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$0.123

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$0.123

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Flip Electronics

USA . 12,000 parts In-Stock

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Vyrian

USA . 3,769 parts In-Stock

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Digiode

USA . 1,941 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Semicontronic

India . 5,675 parts In-Stock

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$0.105

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$0.102

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5,675

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$0.102

$0.102

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Ampacity Inc.

Singapore . 5,672 parts In-Stock

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$0.105

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Corohmni

South Africa . 431 parts In-Stock

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$0.123

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431

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AZTECH Wire

Italy . 571 parts In-Stock

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$18.250

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571

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SupplyDigital Components

Austria . 7,412 parts In-Stock

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Continental Prestige Electronics

USA . 3,627 parts In-Stock

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Argo Parts USA

USA . 3,248 parts In-Stock

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Kulean Microsystems

USA . 1,226 parts In-Stock

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TANS Electronics

Latvia . 1,027 parts In-Stock

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UHIMA Technologies

Türkiye . 991 parts In-Stock

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Corphita

USA . 598 parts In-Stock

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Aztec Data Supply Inc.

USA . 421 parts In-Stock

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421

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Bastille Electronics

Australia . 300 parts In-Stock

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Problanco Electronics

Mexico . 199 parts In-Stock

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Overview

Looking for a reliable and efficient bus driver & transceiver for your electronic applications? Look no further than the NC7WZ240K8X-L22236 by Onsemi. With a reputation for high-quality products, Onsemi delivers top-notch performance and durability. This versatile component is perfect for a wide range of applications, offering customers a valuable solution with its fast propagation delay, low power consumption, and compact design. Trust Onsemi to provide you with the best in electronic components for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material is durable and cost-effective, making this product a reliable choice for various applications.

Propagation Delay At Nominal Supply: 6 ns

With a low propagation delay, this product ensures quick and efficient data transmission, making it ideal for high-speed communication systems.

Surface Mount: YES

Being surface mountable makes installation easy and space-efficient, suitable for compact electronic designs.

No. of Functions: 2

Having multiple functions in a single device increases versatility and functionality, allowing for more diverse applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption and heat generation, making this product energy-efficient.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when disabled, enabling multiple devices to share the same bus line without interference.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is suitable for harsh environments and ensures reliable performance in tough conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making it a versatile choice.

Technical Specifications

Bus Driver & Transceivers NC7WZ240K8X-L22236 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NC7WZ240K8X-L22236 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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