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NC7WZ125L8X-L22185

Onsemi

NC7WZ125L8X-L22185 by Onsemi

The Onsemi NC7WZ125L8X-L22185 is a 2-function bus driver with a propagation delay of 6ns at 1.8V, suitable for industrial applications. It operates b/w -40 to 85°C, has a max I (ol) of 24A, and supports a load capacitance of 50pF. This surface-mount chip carrier with very thin profile is ideal for systems requiring fast signal transmission.

Median Price

$0.142

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 62 parts In-Stock

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$0.191

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$0.191

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$0.191

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Arrow

USA . 5,000 parts In-Stock

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$0.140

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$0.140

Verical

USA . 5,000 parts In-Stock

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$0.142

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$0.142

Distributors (In-Stock)

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Digiode

USA . 292 parts In-Stock

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$0.181

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Nova Conductors

Japan . 700 parts In-Stock

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$0.187

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Flip Electronics

USA . 110,000 parts In-Stock

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Vyrian

USA . 5,576 parts In-Stock

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TME

Poland . 5,000 parts In-Stock

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$0.198

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$0.198

Distributors (Availability)

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Semicontronic

India . 3,166 parts In-Stock

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$0.119

100+ parts

$0.116

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$0.115

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3,166

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Ampacity Inc.

Singapore . 3,089 parts In-Stock

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$0.119

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Corohmni

South Africa . 194 parts In-Stock

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Corphita

USA . 321 parts In-Stock

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$0.172

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321

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Bastille Electronics

Australia . 10 parts In-Stock

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$0.187

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$0.178

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$0.169

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$0.166

10

$0.187

$0.178

$0.169

$0.166

Continental Prestige Electronics

USA . 6,051 parts In-Stock

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$0.187

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$0.183

6,051

$0.187

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$0.183

Argo Parts USA

USA . 1,758 parts In-Stock

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$0.181

1,758

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Advanced Electronics

New Zealand . 62 parts In-Stock

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AZTECH Wire

Italy . 811 parts In-Stock

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$19.000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,790 parts In-Stock

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Microchip USA

USA . 9,685 parts In-Stock

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Problanco Electronics

Mexico . 7,260 parts In-Stock

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SupplyDigital Components

Austria . 5,024 parts In-Stock

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TANS Electronics

Latvia . 4,897 parts In-Stock

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Kulean Microsystems

USA . 2,898 parts In-Stock

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UHIMA Technologies

Türkiye . 990 parts In-Stock

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Aztec Data Supply Inc.

USA . 171 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the NC7WZ125L8X-L22185 by Onsemi - a leading manufacturer in the industry. This versatile bus driver and transceiver offers fast propagation delay, 3-state output characteristics, and a wide operating temperature range, making it perfect for a variety of applications. With a compact chip carrier package and low power consumption, this product provides exceptional value and performance for your projects. Upgrade your systems today with the high-quality and efficient NC7WZ125L8X-L22185 from Onsemi.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate this product onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional chips, improving efficiency and reducing system complexity.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a compatible voltage level commonly found in many electronic systems, ensuring easy integration and compatibility.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance when disabled, providing flexibility in managing signal flow within the system.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, making it suitable for harsh environments and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various operating conditions.

Technical Specifications

Bus Driver & Transceivers NC7WZ125L8X-L22185 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.6 mm

Trade Compliance

NC7WZ125L8X-L22185 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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