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NC7WZ00K8X-L22236

Onsemi

NC7WZ00K8X-L22236 by Onsemi

The Onsemi NC7WZ00K8X-L22236 is a logic gate with 2 functions and inputs, featuring a propagation delay of 9.8ns at 1.8V supply voltage. It operates in temperatures ranging from -40 to 85°C, making it suitable for applications requiring fast signal processing in compact electronic devices. The package style is small outline with very thin profile and shrink pitch, ideal for surface mount assembly with a terminal pitch of 0.5mm.

Median Price

$0.163

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$0.163

100+ parts

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48

$0.163

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Flip Electronics

USA . 24,000 parts In-Stock

1+ parts

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24,000

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Cyclops Electronics Ltd

UK . 6,700 parts In-Stock

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6,700

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Vyrian

USA . 3,003 parts In-Stock

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3,003

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Digiode

USA . 1,851 parts In-Stock

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1,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 329 parts In-Stock

1+ parts

$0.160

100+ parts

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329

$0.160

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$0.163

100+ parts

$0.155

1k+ parts

$0.147

10k+ parts

$0.145

800

$0.163

$0.155

$0.147

$0.145

Continental Prestige Electronics

USA . 5,189 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

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$0.160

5,189

$0.163

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$0.160

Argo Parts USA

USA . 3,767 parts In-Stock

1+ parts

$0.163

100+ parts

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10k+ parts

$0.158

3,767

$0.163

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$0.158

Microchip USA

USA . 5,326 parts In-Stock

1+ parts

$0.961

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5,326

$0.961

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AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$13.832

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852

$13.832

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Aztec Data Supply Inc.

USA . 3,764 parts In-Stock

1+ parts

$17.367

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3,764

$17.367

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Semicontronic

India . 1,446 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

1k+ parts

$20.370

10k+ parts

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1,446

$21.000

$20.475

$20.370

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Ampacity Inc.

Singapore . 271 parts In-Stock

1+ parts

$45.000

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271

$45.000

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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Problanco Electronics

Mexico . 3,325 parts In-Stock

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3,325

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Eastek

USA . 3,000 parts In-Stock

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$0.170

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3,000

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$0.170

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Kulean Microsystems

USA . 1,842 parts In-Stock

1+ parts

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1,842

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TANS Electronics

Latvia . 1,607 parts In-Stock

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1,607

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Corphita

USA . 1,202 parts In-Stock

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1,202

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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985

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SupplyDigital Components

Austria . 466 parts In-Stock

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466

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Overview

Discover the high-quality NC7WZ00K8X-L22236 logic gates by Onsemi, offering unparalleled performance and reliability. With a compact design and low power consumption, this product is perfect for a wide range of applications. Whether you need to boost your electronic devices' efficiency or streamline your circuit designs, this logic gate provides exceptional value and benefits. Trust in Onsemi's expertise and elevate your projects with the NC7WZ00K8X-L22236 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 9.8 ns

With a fast propagation delay, this product ensures quick and efficient signal processing.

Surface Mount: YES

This surface mount option allows for easy installation and space-saving on a circuit board.

No. of Functions: 2

Having two functions in one component simplifies circuit design and saves space.

No. of Inputs: 2

With two inputs, this product offers flexibility in signal processing and logic operations.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various circuit designs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V makes this product energy-efficient.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can handle various types of loads effectively.

No. of Terminals: 8

The eight terminals provide multiple connection points for versatile applications.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

This package style offers a compact design suitable for space-constrained applications.

Maximum I (ol): 32 Amp

With a maximum output current of 32 Amp, this product can drive high loads.

Propagation Delay (tpd): 9.8 ns

The low propagation delay of 9.8 ns ensures fast signal transmission for time-critical applications.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in extreme conditions.

Terminal Finish: TIN

The use of tin terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit board layout and connection options.

Maximum Seated Height: 0.9 mm

With a low seated height of 0.9 mm, this product is suitable for compact designs.

Width: 2 mm

The 2 mm width of the product allows for easy integration into tight spaces.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a minimum supply voltage of 1.65V ensures compatibility with low-power applications.

Length: 2.3 mm

The 2.3 mm length of the product offers a compact form factor for space-saving designs.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections.

Packing Method: TR

The TR packing method provides protection during transportation and storage.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product facilitates precise and efficient PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V ensures compatibility with a wide range of applications.

Maximum Power Supply Current (ICC): 100 mA

With a maximum power supply current of 100 mA, this product can deliver sufficient power for various functions.

Technical Specifications

Logic Gates NC7WZ00K8X-L22236 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

9.8 ns

Propagation Delay (tpd):

9.8 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NC7WZ00K8X-L22236 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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