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NC7SZ27P6X-L22347

Onsemi

NC7SZ27P6X-L22347 by Onsemi

The Onsemi NC7SZ27P6X-L22347 is a CMOS logic gate with 3 inputs and a propagation delay of 8.5 ns. It operates at a nominal voltage of 1.8V and can handle load capacitance up to 50 pF. This small outline, thin profile package is suitable for industrial applications requiring fast signal processing.

Median Price

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4

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1k+

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Flip Electronics

USA . 12,000 parts In-Stock

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Vyrian

USA . 6,111 parts In-Stock

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Digiode

USA . 1,286 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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AZTECH Wire

Italy . 887 parts In-Stock

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$16.020

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Aztec Data Supply Inc.

USA . 240 parts In-Stock

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$24.501

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Ampacity Inc.

Singapore . 603 parts In-Stock

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$40.000

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Semicontronic

India . 1,016 parts In-Stock

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$55.000

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$53.625

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$53.350

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Kulean Microsystems

USA . 7,137 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Problanco Electronics

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SupplyDigital Components

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Türkiye . 984 parts In-Stock

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Overview

Experience the power of precision with the NC7SZ27P6X-L22347 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality logic gates that are designed for optimal performance and reliability. The NC7SZ27P6X-L22347 is no exception, offering customers unparalleled value, benefits, and advantages. With its compact size and surface mount capability, this logic gate is perfect for a wide range of applications. Whether you're working on consumer electronics or industrial automation, the NC7SZ27P6X-L22347 delivers fast propagation delay and low power consumption, making it the ideal choice for your projects. Trust Onsemi to provide you with the cutting-edge technology you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection, making this logic gate suitable for various industrial applications.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay, this logic gate ensures fast and efficient signal processing, which is crucial for time-critical operations.

Surface Mount: YES

Being surface mount compatible, this logic gate allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 1

This logic gate incorporates a single function, simplifying circuit designs and reducing complexity.

No. of Inputs: 3

With three input channels, this logic gate can handle multiple input signals, enabling more complex logic operations.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, optimizing component placement.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V, this logic gate promotes energy efficiency and is well-suited for low-power applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can reliably drive capacitive loads, ensuring stable and accurate signal transmission.

Power Supplies (V): 3.3

Compatible with a 3.3V power supply, this logic gate can seamlessly integrate into existing systems with ease.

No. of Terminals: 6

Featuring six terminals, this logic gate provides sufficient connectivity options, allowing for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enable high-density packing of logic gates on circuit boards, maximizing space utilization.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this logic gate can handle demanding applications, delivering robust and reliable performance.

Propagation Delay (tpd): 19 ns

The propagation delay of 19 ns ensures quick signal propagation through the logic gate, enabling efficient and responsive operation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this logic gate offers reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

The logic gate's minimum operating temperature of -40°C allows for reliable operation in harsh and extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and electrical conductivity, enhancing the longevity and performance of the logic gate.

Terminal Position: DUAL

The dual terminal position facilitates secure and stable connections when installing the logic gate on a circuit board.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this logic gate is compact and space-efficient, suitable for applications with height constraints.

Width: 1.25 mm

The logic gate's width of 1.25 mm contributes to its compact design, making it ideal for space-constrained circuit board layouts.

Minimum Supply Voltage (Vsup): 1.65 V

Operating reliably at a minimum supply voltage of 1.65V, this logic gate is compatible with low-voltage systems and applications.

Length: 2 mm

The logic gate's length of 2 mm further enhances its compact form factor, allowing for efficient space utilization on a circuit board.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, this logic gate can withstand and perform reliably in rugged environments.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption, high noise immunity, and wide voltage tolerances, making it an excellent choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and secure soldering, ensuring reliable electrical connections and simplifying assembly processes.

Packing Method: TR

The TR packing method provides optimum protection during shipping and handling, keeping the logic gates safe from potential damage.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate provides precise and well-spaced terminals, facilitating easy and accurate soldering during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of accommodating a maximum supply voltage of 5.5V, this logic gate offers flexibility and compatibility with various power supply systems.

Technical Specifications

Logic Gates NC7SZ27P6X-L22347 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NC7SZ27P6X-L22347 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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