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NC7SV74K8X

Onsemi

NC7SV74K8X by Onsemi

The Onsemi NC7SV74K8X is a CMOS latch with 1.1V nominal voltage, 30pF load capacitance, and 9.9ns propagation delay. Ideal for industrial applications requiring positive edge triggering, it operates b/w -40 to 85°C with a max frequency of 250MHz.

Median Price

$0.199

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$14.413

100+ parts

$13.116

1k+ parts

$11.819

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50

$14.413

$13.116

$11.819

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Arrow

USA . 6,000 parts In-Stock

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$0.109

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$0.109

Verical

USA . 1,283 parts In-Stock

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$0.297

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$0.169

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1,283

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$0.297

$0.169

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Farnell

UK . 145 parts In-Stock

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$0.199

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145

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$0.199

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Rochester

USA . 36 parts In-Stock

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$0.157

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$0.130

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$0.116

36

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$0.157

$0.130

$0.116

Distributors (In-Stock)

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Digiode

USA . 821 parts In-Stock

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$0.128

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821

$0.128

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Component Electronics Inc.

Canada . 2,916 parts In-Stock

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$1.540

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$1.150

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$1.000

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2,916

$1.540

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Chip Stock

USA . 16,555 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.161

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Flip Electronics

USA . 5,822 parts In-Stock

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Bristol Electronics

USA . 5,339 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,077 parts In-Stock

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NexGen Digital

USA . 3,000 parts In-Stock

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QIE Inc.

USA . 2,500 parts In-Stock

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2,500

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Vyrian

USA . 2,294 parts In-Stock

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Sensible Micro Corp

USA . 2,288 parts In-Stock

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4 Star Electronics, Inc.

USA . 2,286 parts In-Stock

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Semi Source

USA . 1,919 parts In-Stock

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Martec Srl

Italy . 1,470 parts In-Stock

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1,470

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Lantek

USA . 1,215 parts In-Stock

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Speed Components Ltd

Israel . 892 parts In-Stock

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J2 Sourcing AB

Sweden . 881 parts In-Stock

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881

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Prism Electronics

USA . 773 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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ACDS - Activité Composants Distribution Service

France . 495 parts In-Stock

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495

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Flex Direct, LLC

USA . 339 parts In-Stock

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339

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Inventory MP

USA . 270 parts In-Stock

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ComSIT Distribution GmbH

Germany . 113 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,510 parts In-Stock

1+ parts

$0.093

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2,510

$0.093

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Corohmni

South Africa . 499 parts In-Stock

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$0.109

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499

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Corphita

USA . 1,382 parts In-Stock

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$0.122

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$0.122

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Aztec Data Supply Inc.

USA . 2,014 parts In-Stock

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$12.599

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2,014

$12.599

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$14.413

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$13.116

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$11.819

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50

$14.413

$13.116

$11.819

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Perfect Parts

USA . 222,251 parts In-Stock

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CPlus Electronics

USA . 60,000 parts In-Stock

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Metaverse IC Inc.

Canada . 36,800 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,698 parts In-Stock

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Lixinc

USA . 11,685 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,210 parts In-Stock

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SupplyDigital Components

Austria . 3,436 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,827 parts In-Stock

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Continental Prestige Electronics

USA . 2,609 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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GreenTree Electronics

Israel . 1,215 parts In-Stock

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Supply Digital

USA . 771 parts In-Stock

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771

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Futuretech Components

Singapore . 703 parts In-Stock

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703

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UHIMA Technologies

Türkiye . 630 parts In-Stock

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630

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Cyclops Electronics Ltd (Excess)

UK . 595 parts In-Stock

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595

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TANS Electronics

Latvia . 442 parts In-Stock

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Problanco Electronics

Mexico . 214 parts In-Stock

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Overview

Enhance your electronic projects with the NC7SV74K8X by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability, making this latch & flip-flop component a must-have. Ideal for a wide range of applications, this product offers customers unmatched value with its efficient performance, high-speed operation, and versatile functionality. Say goodbye to compromise and hello to innovation with Onsemi's NC7SV74K8X - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for long-term use.

Surface Mount:

YES - Allows for easy and efficient installation on PCBs.

Package Shape:

RECTANGULAR - Compact design saves space in circuit layout.

Nominal Supply Voltage / Vsup (V):

1.1 - Operates efficiently at a low voltage, conserving energy.

Load Capacitance (CL):

30 pF - Ensures smooth and stable operation with minimal power consumption.

Power Supplies (V):

1.2/3.3 - Compatible with a range of power sources for versatility.

No. of Terminals:

8 - Provides multiple connection points for enhanced functionality.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - Ideal for applications with limited space constraints.

Maximum I (ol):

2 Amp - Capable of handling high current loads without overheating.

Propagation Delay (tpd):

9.9 ns - Offers fast response times for time-critical operations.

Maximum Operating Temperature:

85 °C - Suitable for use in varying environmental conditions.

Trigger Type:

POSITIVE EDGE - Allows for precise control and timing in circuit operations.

Minimum Operating Temperature:

40 °C - Functions reliably in extreme cold temperatures.

Terminal Finish:

TIN - Provides corrosion resistance for long-term reliability.

Terminal Position:

DUAL - Offers versatility in circuit design and connectivity options.

Maximum Seated Height:

0.9 mm - Low profile design for compact applications.

Width:

2 mm - Slim design for space-saving configurations.

Output Polarity:

COMPLEMENTARY - Provides complementary outputs for balanced signal processing.

Minimum Supply Voltage (Vsup):

0.9 V - Operates efficiently even at low voltage levels.

Maximum Time At Peak Reflow Temperature (s):

30 - Resistant to high temperatures during reflow processes.

Peak Reflow Temperature °C:

260 - Withstands high reflow temperatures for reliable soldering.

Length:

2.3 mm - Compact size for fitting into tight spaces.

Temperature Grade:

INDUSTRIAL - Designed for industrial-grade applications with robust performance.

Maximum Frequency At Nominal Supply:

150000000 Hz - Supports high-speed operations for data processing.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and high speed.

Terminal Form:

GULL WING - Ensures secure and reliable connections on PCBs.

Packing Method:

TR - Secure packaging for safe transportation and storage.

Terminal Pitch:

0.5 mm - Allows for precise and compact circuit layout.

Minimum fmax:

250 MHz - Capable of handling high-frequency operations.

Maximum Supply Voltage (Vsup):

3.6 V - Compatible with a wide range of power sources for flexibility.

Technical Specifications

Latches & Flip-Flops NC7SV74K8X attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay (tpd):

9.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NC7SV74K8X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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