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NB7VQ1006MMNTXG

Onsemi

NB7VQ1006MMNTXG by Onsemi

NB7VQ1006MMNTXG by Onsemi is a Telecom Interface IC with 24 terminals in a square chip carrier package. Operating at -40 to 85 °C, it has a supply voltage of 1.8V and consumes 0.2mA current. Ideal for telecom circuits, this IC is surface mountable and features matte tin terminal finish.

Median Price

$32.362

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,457 parts In-Stock

1+ parts

$36.400

100+ parts

$27.735

1k+ parts

-

10k+ parts

$23.620

1,457

$36.400

$27.735

-

$23.620

Chip1Stop

Japan . 1,883 parts In-Stock

1+ parts

$117.000

100+ parts

$57.800

1k+ parts

$38.400

10k+ parts

-

1,883

$117.000

$57.800

$38.400

-

Flip Electronics (Authorized)

USA . 7,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,295

-

-

-

-

Rochester

USA . 3,030 parts In-Stock

1+ parts

-

100+ parts

$22.660

1k+ parts

$20.270

10k+ parts

$19.080

3,030

-

$22.660

$20.270

$19.080

Verical

USA . 3,030 parts In-Stock

1+ parts

-

100+ parts

$28.325

1k+ parts

$25.337

10k+ parts

$23.850

3,030

-

$28.325

$25.337

$23.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 878 parts In-Stock

1+ parts

$23.921

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$23.921

-

-

-

Vyrian

USA . 899 parts In-Stock

1+ parts

$25.180

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$25.180

-

-

-

Flip Electronics

USA . 7,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 863 parts In-Stock

1+ parts

$22.662

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$22.662

-

-

-

Corohmni

South Africa . 394 parts In-Stock

1+ parts

$25.180

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$25.180

-

-

-

Microchip USA

USA . 4,399 parts In-Stock

1+ parts

$55.685

100+ parts

-

1k+ parts

-

10k+ parts

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4,399

$55.685

-

-

-

Perfect Parts

USA . 20,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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20,994

-

-

-

-

TANS Electronics

Latvia . 7,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,259

-

-

-

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Kulean Microsystems

USA . 5,594 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,594

-

-

-

-

Problanco Electronics

Mexico . 2,271 parts In-Stock

1+ parts

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2,271

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-

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GreenTree Electronics

Israel . 1,983 parts In-Stock

1+ parts

-

100+ parts

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1,983

-

-

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Authorized Procurement Solutions

USA . 1,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,883

-

-

-

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iodParts Technologies Inc.

India . 1,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,883

-

-

-

-

UHIMA Technologies

Türkiye . 582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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582

-

-

-

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SupplyDigital Components

Austria . 582 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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582

-

-

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Kepictronics

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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440

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-

Overview

Upgrade your telecom interface systems with the NB7VQ1006MMNTXG by Onsemi. This high-quality IC offers unmatched reliability and performance, thanks to its cutting-edge design and innovative technology. Ideal for a wide range of applications in the telecommunications industry, this product provides customers with seamless integration, efficient power management, and optimal functionality. Trust Onsemi to deliver excellence in every detail, ensuring that your projects will thrive with the NB7VQ1006MMNTXG at its core.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 1.8/2.5

Supports a wide range of power supply voltages, making it versatile and compatible with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments and applications.

Terminal Finish: MATTE TIN

Provides a reliable and stable connection for the terminals, minimizing the risk of corrosion or signal interference.

Width: 4 mm

Compact size allows for space-saving installation in tight or crowded PCB layouts.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes, ensuring secure and durable solder joints.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making it suitable for harsh environments.

Nominal Supply Voltage: 1.8 V

Efficiently operates on low supply voltage, making it energy-efficient and cost-effective.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density packaging, maximizing functionality in a limited space.

Technical Specifications

Other Function Telecom Interface ICs NB7VQ1006MMNTXG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NB7VQ1006MMNTXG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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