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NB7VQ1006MMNG

Onsemi

NB7VQ1006MMNG by Onsemi

NB7VQ1006MMNG by Onsemi is a telecom interface IC with 24 terminals in a square chip carrier package. Operating at temperatures from -40 to 85 °C, it has a supply voltage of 1.8V and max current of 0.2mA. Ideal for telecom circuits, this IC is designed for industrial-grade applications requiring low power consumption.

Median Price

$45.220

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$44.350

100+ parts

$31.240

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81

$44.350

$31.240

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DigiKey

USA . 159 parts In-Stock

1+ parts

$45.220

100+ parts

$32.822

1k+ parts

$31.537

10k+ parts

-

159

$45.220

$32.822

$31.537

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Chip1Stop

Japan . 154 parts In-Stock

1+ parts

$148.000

100+ parts

$73.100

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154

$148.000

$73.100

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Flip Electronics (Authorized)

USA . 15,640 parts In-Stock

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15,640

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Distributors (In-Stock)

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Digiode

USA . 2,199 parts In-Stock

1+ parts

$27.702

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2,199

$27.702

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Flip Electronics

USA . 11,592 parts In-Stock

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11,592

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Vyrian

USA . 7,809 parts In-Stock

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7,809

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Chip Stock

USA . 5,100 parts In-Stock

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5,100

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Distributors (Availability)

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Corphita

USA . 995 parts In-Stock

1+ parts

$26.244

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995

$26.244

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Corohmni

South Africa . 316 parts In-Stock

1+ parts

$29.160

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316

$29.160

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Microchip USA

USA . 1,968 parts In-Stock

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$100.096

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1,968

$100.096

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Kulean Microsystems

USA . 7,429 parts In-Stock

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7,429

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TANS Electronics

Latvia . 6,898 parts In-Stock

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6,898

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SupplyDigital Components

Austria . 4,837 parts In-Stock

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4,837

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Problanco Electronics

Mexico . 1,538 parts In-Stock

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1,538

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UHIMA Technologies

Türkiye . 908 parts In-Stock

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908

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Perfect Parts

USA . 759 parts In-Stock

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759

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GreenTree Electronics

Israel . 254 parts In-Stock

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254

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Authorized Procurement Solutions

USA . 154 parts In-Stock

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154

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Kepictronics

USA . 130 parts In-Stock

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130

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Overview

Experience seamless connectivity and top-notch performance with the NB7VQ1006MMNG by Onsemi. This cutting-edge telecom interface IC boasts unparalleled quality and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications in the telecom industry, this product offers exceptional value and benefits to customers seeking advanced solutions for their connectivity needs. Upgrade your system with the NB7VQ1006MMNG and enjoy the advantages of superior functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and provides good protection for the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto printed circuit boards, saving time and effort during production.

Power Supplies (V): 1.8/2.5

Multiple power supply options make this IC versatile and compatible with a range of systems that may require different voltage levels.

No. of Terminals: 24

Having a high number of terminals allows for more connectivity options and functionalities, making the IC suitable for complex telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and maintain stable performance.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides good conductivity and solderability, ensuring secure connections and reliable operation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates that this IC is designed to operate in rugged industrial environments, offering robust performance in challenging conditions.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage of 1.8 V results in reduced power consumption, making this IC energy-efficient and cost-effective.

Technical Specifications

Other Function Telecom Interface ICs NB7VQ1006MMNG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NB7VQ1006MMNG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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