Loading...

NB7L216MN

Onsemi

NB7L216MN by Onsemi

NB7L216MN by Onsemi is a 16-terminal interface IC with a supply voltage range of +-2.5/+-3.3V, suitable for industrial applications. It operates b/w -40 to 85 °C and has a max supply current of 35mA. With a compact square package style and surface-mount capability, it is ideal for space-constrained designs requiring reliable performance in harsh environments.

Median Price

$47.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 615 parts In-Stock

1+ parts

-

100+ parts

$41.140

1k+ parts

$36.810

10k+ parts

$34.650

615

-

$41.140

$36.810

$34.650

DigiKey

USA . 615 parts In-Stock

1+ parts

-

100+ parts

$47.670

1k+ parts

$47.670

10k+ parts

$47.670

615

-

$47.670

$47.670

$47.670

Verical

USA . 615 parts In-Stock

1+ parts

-

100+ parts

$51.425

1k+ parts

$46.013

10k+ parts

$43.313

615

-

$51.425

$46.013

$43.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$12.584

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$12.584

-

-

-

Digiode

USA . 2,393 parts In-Stock

1+ parts

$43.548

100+ parts

-

1k+ parts

-

10k+ parts

-

2,393

$43.548

-

-

-

Vyrian

USA . 8,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,822

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,380 parts In-Stock

1+ parts

$41.256

100+ parts

-

1k+ parts

-

10k+ parts

-

1,380

$41.256

-

-

-

Corohmni

South Africa . 348 parts In-Stock

1+ parts

$41.420

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$41.420

-

-

-

Component Stockers USA

USA . 591 parts In-Stock

1+ parts

$46.760

100+ parts

$43.950

1k+ parts

-

10k+ parts

-

591

$46.760

$43.950

-

-

TANS Electronics

Latvia . 8,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,102

-

-

-

-

Problanco Electronics

Mexico . 6,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,334

-

-

-

-

Kulean Microsystems

USA . 6,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,009

-

-

-

-

SupplyDigital Components

Austria . 5,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,373

-

-

-

-

Microchip USA

USA . 4,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,701

-

-

-

-

Continental Prestige Electronics

USA . 615 parts In-Stock

1+ parts

-

100+ parts

$39.030

1k+ parts

-

10k+ parts

-

615

-

$39.030

-

-

UHIMA Technologies

Türkiye . 559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

559

-

-

-

-

Overview

Discover the unparalleled quality and reliability of the NB7L216MN by Onsemi, a leading manufacturer in the industry. This cutting-edge interface IC offers a wide range of applications, making it a versatile solution for various projects. With its compact design and advanced features, this product provides exceptional value and benefits to customers looking for top-notch performance and efficiency. Trust Onsemi to deliver excellence with the NB7L216MN, where innovation meets quality for all your interface circuit needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, making this product suitable for mass production and compact designs.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for versatility in power supply options, accommodating various system requirements.

Package Shape: SQUARE

The square package shape provides efficient use of space on the PCB, making it ideal for compact electronic devices.

Power Supplies (V): +-2.5/+-3.3

Support for dual power supply voltages (+-2.5V and +-3.3V) offers flexibility in system design and integration.

No. of Terminals: 16

With 16 terminals, this IC provides multiple connection points for interfacing with other components, enhancing functionality and compatibility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal performance and overall reliability of the product.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the product suitable for diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold environments, increasing the product's usability.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, facilitating the easy assembly of the IC onto the PCB.

Terminal Position: QUAD

The quad terminal position provides stable connection points, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1 mm

The low maximum seated height enables a slim and compact overall design of the electronic device, saving space in cramped installations.

Width: 3 mm

The narrow width of 3mm allows for efficient placement on the PCB, contributing to a tidy and organized circuit layout.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance of 235 °C ensures that the IC can withstand the reflow soldering process without compromising its performance.

Length: 3 mm

The short length of 3mm further contributes to the compact form factor of the IC, enabling space-saving designs in electronic systems.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding industrial environments, making the product suitable for rugged applications.

Terminal Form: NO LEAD

The lead-free terminal form aligns with environmental regulations and promotes sustainable manufacturing practices.

Maximum Supply Current: 35 mA

The moderate maximum supply current consumption of 35mA allows for efficient power management and extends the product's operational lifespan.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides a stable operating voltage for the IC, ensuring consistent performance in the intended application.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density PCB layouts, facilitating intricate circuit designs with reduced space constraints.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product serves as a crucial bridge between different electronic components, enabling seamless communication and data transfer within a system.

Technical Specifications

Other Function Interface ICs NB7L216MN attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB7L216MN Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3