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NB7L216MNG

Onsemi

NB7L216MNG by Onsemi

NB7L216MNG by Onsemi is a 16-terminal interface IC with a supply voltage range of +-2.5/+-3.3V, suitable for industrial applications. It features a max operating temperature of 85°C and terminal finish in nickel gold palladium, making it ideal for surface mount installations in various electronic devices. With a compact square package style and no-lead terminal form, this chip carrier is designed for high-performance systems requiring precise signal interfacing.

Median Price

$43.210

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$8.600

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-

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1

$8.600

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Arrow

USA . 1 parts In-Stock

1+ parts

$37.780

100+ parts

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1

$37.780

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DigiKey

USA . 73 parts In-Stock

1+ parts

$54.450

100+ parts

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$45.870

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73

$54.450

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$45.870

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Rochester

USA . 2,265 parts In-Stock

1+ parts

-

100+ parts

$43.210

1k+ parts

$38.660

10k+ parts

$36.380

2,265

-

$43.210

$38.660

$36.380

Verical

USA . 1,496 parts In-Stock

1+ parts

-

100+ parts

$54.013

1k+ parts

$48.325

10k+ parts

$45.475

1,496

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$54.013

$48.325

$45.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 554 parts In-Stock

1+ parts

$8.067

100+ parts

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554

$8.067

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Vyrian

USA . 5,277 parts In-Stock

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5,277

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Nova Conductors

Japan . 23 parts In-Stock

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Lantek

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 868 parts In-Stock

1+ parts

$7.220

100+ parts

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868

$7.220

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Corphita

USA . 1,639 parts In-Stock

1+ parts

$7.643

100+ parts

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1,639

$7.643

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Corohmni

South Africa . 77 parts In-Stock

1+ parts

$8.492

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77

$8.492

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AZTECH Wire

Italy . 1,166 parts In-Stock

1+ parts

$10.400

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1,166

$10.400

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A-Z Elektronik GmbH

Germany . 7,038 parts In-Stock

1+ parts

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7,038

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Kulean Microsystems

USA . 5,213 parts In-Stock

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5,213

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TANS Electronics

Latvia . 5,157 parts In-Stock

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5,157

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Microchip USA

USA . 4,991 parts In-Stock

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4,991

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Continental Prestige Electronics

USA . 2,926 parts In-Stock

1+ parts

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100+ parts

$40.980

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2,926

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$40.980

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SupplyDigital Components

Austria . 2,080 parts In-Stock

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2,080

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

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UHIMA Technologies

Türkiye . 821 parts In-Stock

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821

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Problanco Electronics

Mexico . 691 parts In-Stock

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691

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Perfect Parts

USA . 421 parts In-Stock

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421

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Kepictronics

USA . 204 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 62 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the NB7L216MNG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that are designed to enhance performance and reliability. This interface IC is ideal for a wide range of applications, offering seamless connectivity and precise functionality. With a compact square package shape and minimal power consumption, this IC is perfect for space-constrained projects where efficiency is key. Experience the value and benefits of the NB7L216MNG by Onsemi and take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for automated manufacturing processes.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage capability makes this product versatile and compatible with a wide range of power supply configurations.

Package Shape: SQUARE

The square package shape enables efficient use of board space and easy placement on the PCB, making it ideal for compact designs.

Power Supplies (V): +-2.5/+-3.3

The dual power supply options provide flexibility in different voltage requirements, enhancing the product's compatibility with various systems.

No. of Terminals: 16

The higher number of terminals allows for more connections and functionalities, making this product suitable for complex interface circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer different advantages such as thermal management, space-saving, and compatibility with different assembly methods.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage requirement ensures efficient power consumption and operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in harsh environmental conditions and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the product can operate effectively in extreme cold environments.

Terminal Finish: NICKEL GOLD PALLADIUM

The terminal finish provides excellent corrosion resistance and reliability, ensuring long-term performance and durability.

Terminal Position: QUAD

The quad terminal configuration allows for easy and secure connections, enhancing the stability and reliability of the product.

Maximum Seated Height: 1 mm

The low maximum seated height enables the product to be used in compact designs and in applications with height restrictions.

Width: 3 mm

The narrow width dimension allows for efficient use of board space and compact layout designs, making this product suitable for smaller form factor applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures reliable and consistent soldering during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures proper soldering and bonding of the product during assembly, resulting in reliable connections.

Length: 3 mm

The compact length dimension allows for space-efficient placement on the PCB and compact overall product design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments with wide temperature variations.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and aligns with environmental regulations, making this product environmentally friendly.

Maximum Supply Current: 35 mA

The moderate maximum supply current requirement ensures efficient power consumption and compatibility with various power sources.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a standard operating voltage level for the product, ensuring compatibility with common power supply configurations.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and compact layout designs, making this product suitable for space-constrained applications.

Interface IC Type: INTERFACE CIRCUIT

The specific interface circuit type indicates the product's functionality and compatibility with communication protocols and interface requirements.

Technical Specifications

Other Function Interface ICs NB7L216MNG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7L216MNG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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