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NB7L216MNR2

Onsemi

NB7L216MNR2 by Onsemi

NB7L216MNR2 by Onsemi is a square-shaped interface IC with 16 terminals and a supply voltage range of +-2.5/+-3.3V. It operates in industrial temperatures from -40 to 85 °C, with a max supply current of 35mA. This chip carrier package is suitable for various other function interface applications requiring precise signal transmission at low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,017 parts In-Stock

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Digiode

USA . 1,839 parts In-Stock

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Component Stockers USA

USA . 329 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 7,097 parts In-Stock

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SupplyDigital Components

Austria . 5,177 parts In-Stock

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Microchip USA

USA . 4,028 parts In-Stock

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Problanco Electronics

Mexico . 2,176 parts In-Stock

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UHIMA Technologies

Türkiye . 746 parts In-Stock

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TANS Electronics

Latvia . 668 parts In-Stock

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Corphita

USA . 497 parts In-Stock

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Corohmni

South Africa . 310 parts In-Stock

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Overview

Enhance your electronic devices with the NB7L216MNR2 by Onsemi, a top-quality Other Function Interface IC that exudes reliability and precision. Onsemi's reputation for excellence shines through in this product, offering versatile applications and seamless integration into various systems. With its advanced features and innovative design, the NB7L216MNR2 delivers unmatched performance and efficiency, providing customers with exceptional value and benefits. Upgrade your technology with Onsemi's cutting-edge interface circuit, setting new standards in the industry.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.465 V

Provides a wide range of operating voltage, making it suitable for various applications.

Package Shape: SQUARE

Square package shape helps in efficient layout design on PCBs and saves space.

Power Supplies (V): +-2.5/+-3.3

Supports dual power supplies with stable voltage levels, ensuring reliable performance.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options for different mounting and heat dissipation requirements.

Minimum Supply Voltage: 2.375 V

Can operate at low supply voltages, making it energy efficient.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for harsh environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position facilitates easy installation and connectivity in the circuit.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and reduces the overall profile of the product.

Width: 3 mm

Narrow width for space-saving on the PCB layout.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during manufacturing processes.

Length: 3 mm

Compact length for efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Terminal Form: NO LEAD

No-lead terminal form for a lead-free and environmentally friendly product.

Maximum Supply Current: 35 mA

Low supply current requirement for power-efficient operation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for dense mounting and integration in the circuit.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components or systems, ensuring seamless communication.

Technical Specifications

Other Function Interface ICs NB7L216MNR2 attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB7L216MNR2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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