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NB2308AI3DR2G

Onsemi

NB2308AI3DR2G by Onsemi

NB2308AI3DR2G clock driver by Onsemi features 16 terminals, 3.3V supply voltage, and 8A max I (ol). Ideal for industrial applications requiring a small outline package with a temperature range of -40 to 85 °C. This CMOS technology device offers 8 true outputs at a min frequency of 15MHz.

Median Price

$0.754

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$0.740

1k+ parts

$0.614

10k+ parts

$0.547

7,500

-

$0.740

$0.614

$0.547

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.767

10k+ parts

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7,500

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-

$0.767

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Distributors (In-Stock)

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Digiode

USA . 1,421 parts In-Stock

1+ parts

$0.577

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1,421

$0.577

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Vyrian

USA . 5,285 parts In-Stock

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5,285

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Connector Distribution Corp

USA . 31 parts In-Stock

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Right Parts Inc.

USA . 31 parts In-Stock

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31

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Distributors (Availability)

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Corphita

USA . 1,120 parts In-Stock

1+ parts

$0.546

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1,120

$0.546

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Corohmni

South Africa . 68 parts In-Stock

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$0.607

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68

$0.607

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AZTECH Wire

Italy . 948 parts In-Stock

1+ parts

$10.170

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948

$10.170

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Kulean Microsystems

USA . 7,669 parts In-Stock

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7,669

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 3,696 parts In-Stock

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3,696

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TANS Electronics

Latvia . 3,402 parts In-Stock

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Kepictronics

USA . 980 parts In-Stock

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SupplyDigital Components

Austria . 679 parts In-Stock

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Microchip USA

USA . 135 parts In-Stock

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Overview

Experience seamless and efficient clock signal distribution with the NB2308AI3DR2G by Onsemi. As a leading manufacturer in clock drivers and buffers, Onsemi ensures top-notch quality and reliability in all their products. Ideal for a wide range of applications, this clock driver offers exceptional value by providing stable and precise output characteristics. Say goodbye to timing issues and hello to smooth operation with the NB2308AI3DR2G. Trust Onsemi to deliver superior performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Enables easy and secure installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, compatible with many electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Output Characteristics: 3-STATE

Allows the outputs to be in a high-impedance state when not actively driving a signal, reducing power consumption and interference.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Clock Drivers & Buffers NB2308AI3DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

15 MHz

Trade Compliance

NB2308AI3DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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