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NB2308AI2HDTG

Onsemi

NB2308AI2HDTG by Onsemi

NB2308AI2HDTG clock driver by Onsemi operates at 3.3V with 16 terminals in a small outline package. It features 8 true outputs, 3-state output characteristics, and a max operating temperature of 85 °C. Ideal for industrial applications requiring precise timing control and signal buffering.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,432 parts In-Stock

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Digiode

USA . 2,164 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 494 parts In-Stock

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$8.290

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494

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SupplyDigital Components

Austria . 8,297 parts In-Stock

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Problanco Electronics

Mexico . 7,003 parts In-Stock

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Kulean Microsystems

USA . 5,116 parts In-Stock

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TANS Electronics

Latvia . 2,780 parts In-Stock

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2,780

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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Corphita

USA . 473 parts In-Stock

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Microchip USA

USA . 353 parts In-Stock

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Corohmni

South Africa . 321 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB2308AI2HDTG Clock Drivers & Buffers by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for a wide range of applications. The NB2308AI2HDTG offers customers unmatched value with its efficient design and advanced features. Upgrade your systems today and experience the benefits of seamless operation and improved functionality. Trust Onsemi to provide you with innovative solutions that elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic devices, making this clock driver compatible with a wide range of applications.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this clock driver can effectively drive multiple components without risk of overload.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and performance in a variety of environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexibility in controlling the output signal, making this clock driver suitable for different application scenarios.

Maximum Same Edge Skew (tskwd): 0.2 ns

The low skew ensures accurate synchronization of signals, making this clock driver ideal for applications where timing precision is crucial.

Minimum fmax: 15 MHz

With a minimum frequency of 15MHz, this clock driver can support high-speed data processing and communication.

Technical Specifications

Clock Drivers & Buffers NB2308AI2HDTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

15 MHz

Trade Compliance

NB2308AI2HDTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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