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NB2308AC1HDT

Onsemi

NB2308AC1HDT by Onsemi

NB2308AC1HDT clock driver by Onsemi features 16 terminals, 3.3V supply voltage, and 12A max I (ol). Ideal for applications requiring a CMOS technology-based clock buffer with a small outline package style and standard input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,827 parts In-Stock

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Digiode

USA . 2,270 parts In-Stock

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AZTECH Wire

Italy . 122 parts In-Stock

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$10.500

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Component Stockers USA

USA . 524 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 3,914 parts In-Stock

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Kulean Microsystems

USA . 3,508 parts In-Stock

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Problanco Electronics

Mexico . 3,409 parts In-Stock

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Corphita

USA . 2,333 parts In-Stock

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UHIMA Technologies

Türkiye . 489 parts In-Stock

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Corohmni

South Africa . 421 parts In-Stock

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TANS Electronics

Latvia . 245 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the NB2308AC1HDT by Onsemi. As a leader in clock drivers & buffers, Onsemi delivers top-notch quality products for various applications. This innovative product offers customers unparalleled value, benefits, and advantages, ensuring smooth operation and efficiency. Elevate your projects with the reliability and excellence that Onsemi is known for, setting you apart from the competition. Choose Onsemi for superior performance and results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and insulating properties.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and reducing assembly time.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of signal types and levels.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a commonly used voltage level, making it compatible with many systems.

Maximum I (ol): 12 Amp

High output current capability allows for driving multiple devices without the need for additional buffers.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions, suitable for various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for clock driver applications.

Minimum fmax: 133.3 MHz

Supports high-frequency operation, making it suitable for high-speed clock signal applications.

Technical Specifications

Clock Drivers & Buffers NB2308AC1HDT attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2308AC1HDT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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