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NB2308AC1DG

Onsemi

NB2308AC1DG by Onsemi

NB2308AC1DG clock driver by Onsemi operates at 3.3V, with 16 terminals and a max I (ol) of 8A. It features a small outline package style, CMOS technology, and 3-STATE output characteristics. Ideal for applications requiring precise clock signal distribution in commercial temperature environments up to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,779 parts In-Stock

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Digiode

USA . 548 parts In-Stock

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LWI Electronics Inc

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AZTECH Wire

Italy . 1,093 parts In-Stock

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Problanco Electronics

Mexico . 7,819 parts In-Stock

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Kulean Microsystems

USA . 5,479 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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TANS Electronics

Latvia . 4,282 parts In-Stock

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Corphita

USA . 1,404 parts In-Stock

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UHIMA Technologies

Türkiye . 626 parts In-Stock

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SupplyDigital Components

Austria . 474 parts In-Stock

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Microchip USA

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Corohmni

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Overview

Enhance your electronics projects with the NB2308AC1DG Clock Driver & Buffer from Onsemi. Crafted with precision and expertise, this versatile component offers seamless performance and reliability, making it ideal for a wide range of applications. With its compact design and advanced features, customers can expect superior quality and functionality. Elevate your projects to new heights with the NB2308AC1DG, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resilience to the product, making it suitable for various environments and handling conditions.

Surface Mount: YES

Being surface mountable facilitates easy integration onto circuit boards, saving space and simplifying the assembly process.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making this product versatile and easy to use.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is commonly used in many electronic systems, providing compatibility and interoperability with existing setups.

Maximum I (ol): 8 Amp

The high maximum output current capability of 8 Amp ensures robust performance and the ability to drive multiple devices without risk of overload.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand moderate heat conditions, increasing its reliability in various environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures the product can function effectively even in colder environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product energy-efficient and versatile.

Minimum fmax: 133.3 MHz

With a minimum frequency of 133.3 MHz, this clock driver & buffer can meet the demanding performance requirements of high-speed applications.

Technical Specifications

Clock Drivers & Buffers NB2308AC1DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2308AC1DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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