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NB2305AI1HDTG

Onsemi

NB2305AI1HDTG by Onsemi

NB2305AI1HDTG clock driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.33MHz. It is ideal for industrial applications requiring precise timing synchronization in compact spaces due to its small outline package style and dual terminal position.

Median Price

$0.619

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 80,424 parts In-Stock

1+ parts

-

100+ parts

$0.608

1k+ parts

$0.504

10k+ parts

$0.450

80,424

-

$0.608

$0.504

$0.450

Verical

USA . 80,377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

$0.562

80,377

-

-

$0.630

$0.562

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 851 parts In-Stock

1+ parts

$0.473

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$0.473

-

-

-

Vyrian

USA . 7,816 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,816

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 64 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$0.400

-

-

-

Corphita

USA . 1,158 parts In-Stock

1+ parts

$0.448

100+ parts

-

1k+ parts

-

10k+ parts

-

1,158

$0.448

-

-

-

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$0.450

-

-

-

AZTECH Wire

Italy . 267 parts In-Stock

1+ parts

$15.700

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$15.700

-

-

-

Continental Prestige Electronics

USA . 82,318 parts In-Stock

1+ parts

-

100+ parts

$0.424

1k+ parts

-

10k+ parts

-

82,318

-

$0.424

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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13,327

-

-

-

-

Problanco Electronics

Mexico . 8,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

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8,200

-

-

-

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SupplyDigital Components

Austria . 7,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,800

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-

-

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TANS Electronics

Latvia . 6,455 parts In-Stock

1+ parts

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100+ parts

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6,455

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-

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Microchip USA

USA . 5,570 parts In-Stock

1+ parts

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100+ parts

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5,570

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Kulean Microsystems

USA . 2,177 parts In-Stock

1+ parts

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2,177

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Perfect Parts

USA . 974 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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974

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UHIMA Technologies

Türkiye . 345 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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345

-

-

-

-

Overview

Unlock the power of precision with the NB2305AI1HDTG clock driver by Onsemi. Designed with top-notch quality and cutting-edge technology, this clock driver delivers unmatched performance and reliability. Ideal for a wide range of applications, this product ensures seamless synchronization and timing control. Experience the value of enhanced efficiency and productivity with the NB2305AI1HDTG. Trust in Onsemi's reputation for excellence and enjoy the benefits of optimal clock management in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for a variety of environments.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high heat environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for use in a wide range of climates and conditions.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity and integration within electronic circuits.

Maximum I (ol): 12 Amp

A maximum output current of 12 Amp ensures reliable power delivery, making this product suitable for driving clock signals with precision.

Width: 3 mm

The compact width of 3mm enables space-saving designs and easy integration into electronic systems with limited space.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various applications.

Technical Specifications

Clock Drivers & Buffers NB2305AI1HDTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

133.33 MHz

Trade Compliance

NB2305AI1HDTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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