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NB2305AI1HDR2G

Onsemi

NB2305AI1HDR2G by Onsemi

NB2305AI1HDR2G clock driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.33MHz. Ideal for industrial applications requiring precise timing control in compact spaces due to its small outline package style and dual terminal position.

Median Price

$2.136

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 15 parts In-Stock

1+ parts

$3.580

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15

$3.580

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Rochester

USA . 17,500 parts In-Stock

1+ parts

-

100+ parts

$0.692

1k+ parts

$0.574

10k+ parts

$0.512

17,500

-

$0.692

$0.574

$0.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,499 parts In-Stock

1+ parts

$3.401

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1,499

$3.401

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Flip Electronics

USA . 17,500 parts In-Stock

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17,500

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Vyrian

USA . 8,705 parts In-Stock

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Component Sense

UK . 2,500 parts In-Stock

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2,500

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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LWI Electronics Inc

India . 4 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$0.740

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69

$0.740

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Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$3.040

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15

$3.040

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Corphita

USA . 395 parts In-Stock

1+ parts

$3.222

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395

$3.222

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Microchip USA

USA . 275 parts In-Stock

1+ parts

$3.542

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$3.542

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Component Stockers USA

USA . 9,173 parts In-Stock

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$8.500

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$8.500

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AZTECH Wire

Italy . 174 parts In-Stock

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$20.910

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Kepictronics

USA . 46,000 parts In-Stock

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Perfect Parts

USA . 44,453 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,070 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,286 parts In-Stock

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Kulean Microsystems

USA . 5,473 parts In-Stock

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Problanco Electronics

Mexico . 5,314 parts In-Stock

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SupplyDigital Components

Austria . 3,966 parts In-Stock

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TANS Electronics

Latvia . 3,271 parts In-Stock

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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Metaverse IC Inc.

Canada . 230 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 15 parts In-Stock

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15

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Overview

Discover the NB2305AI1HDR2G by Onsemi, a top-of-the-line clock driver & buffer that sets the standard for quality and reliability. With a focus on precision engineering and cutting-edge technology, Onsemi has developed a product that exceeds expectations in various applications. This compact and efficient device not only delivers superior performance but also offers customers unmatched value and benefits. Elevate your projects with the NB2305AI1HDR2G and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and can withstand various environmental conditions, making this product a reliable choice.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V is commonly used in many electronic devices, making this clock driver compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this clock driver can handle high temperature environments, ensuring stable performance under challenging conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this clock driver energy-efficient and reliable for data transmission.

Technical Specifications

Clock Drivers & Buffers NB2305AI1HDR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

133.33 MHz

Trade Compliance

NB2305AI1HDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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