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NB2305AI1DR2

Onsemi

NB2305AI1DR2 by Onsemi

NB2305AI1DR2 clock driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.33MHz. It is ideal for industrial applications requiring precise timing synchronization in compact spaces due to its small outline package style and standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,593 parts In-Stock

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Digiode

USA . 1,042 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 363 parts In-Stock

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$11.030

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363

$11.030

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$19.649

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$17.881

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$16.112

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$19.649

$17.881

$16.112

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Component Stockers USA

USA . 692 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,369 parts In-Stock

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SupplyDigital Components

Austria . 8,344 parts In-Stock

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Problanco Electronics

Mexico . 7,608 parts In-Stock

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Kulean Microsystems

USA . 3,403 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,341 parts In-Stock

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Corphita

USA . 1,402 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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Corohmni

South Africa . 335 parts In-Stock

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Microchip USA

USA . 138 parts In-Stock

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Overview

Experience seamless clock signal distribution with the NB2305AI1DR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Clock Drivers & Buffers that guarantee reliable performance and precision timing for various applications. Whether you're in need of clock management solutions for networking, telecommunications, or industrial automation, this product offers unparalleled value with its small outline package, low power consumption, and wide temperature range. Stay ahead of the competition with the NB2305AI1DR2 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable devices.

Surface Mount: YES

This feature allows for easy and convenient integration onto PCBs, saving space and simplifying the manufacturing process.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of signals, making the product versatile in various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V enables efficient power consumption and compatibility with common power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and operate reliably in industrial settings.

Technical Specifications

Clock Drivers & Buffers NB2305AI1DR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

133.33 MHz

Trade Compliance

NB2305AI1DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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