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NB2304AI2D

Onsemi

NB2304AI2D by Onsemi

NB2304AI2D Clock Driver by Onsemi operates at 3.3V, with 4 true outputs and a max frequency of 133.3MHz. Ideal for industrial applications requiring precise timing synchronization in compact spaces due to its small outline package style and standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 3,500 parts In-Stock

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Vyrian

USA . 1,962 parts In-Stock

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Digiode

USA . 1,499 parts In-Stock

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AZTECH Wire

Italy . 623 parts In-Stock

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$8.360

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Problanco Electronics

Mexico . 4,010 parts In-Stock

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TANS Electronics

Latvia . 2,840 parts In-Stock

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Kulean Microsystems

USA . 1,955 parts In-Stock

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Corphita

USA . 1,747 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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SupplyDigital Components

Austria . 380 parts In-Stock

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UHIMA Technologies

Türkiye . 340 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the NB2304AI2D clock driver and buffer from Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. From its small outline package to its industrial-grade temperature rating, the NB2304AI2D ensures optimal performance and precision. Upgrade your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, making the product long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at 3.3V, a common voltage in many electronic systems.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing performance.

Minimum fmax: 133.3 MHz

High maximum frequency allows for fast signal processing, making the product suitable for high-speed applications.

Technical Specifications

Clock Drivers & Buffers NB2304AI2D attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.4 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2304AI2D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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