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MM74HCT74MX

Onsemi

MM74HCT74MX by Onsemi

MM74HCT74MX by Onsemi is a dual-function latch with 44ns propagation delay and 4A max I (ol). It operates at a nominal voltage of 5V, suitable for industrial applications requiring positive edge triggering. With a compact small outline package style, it offers complementary output polarity and can handle load capacitance up to 50pF.

Median Price

$0.153

Lifecycle Status

Suppliers In-Stock

27

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1k+

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Arrow

USA . 122 parts In-Stock

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$0.113

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$0.047

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Mouser Electronics

USA . 4,814 parts In-Stock

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$0.280

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$0.146

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$0.140

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$0.129

4,814

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Rochester

USA . 163,634 parts In-Stock

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$0.153

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$0.127

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$0.113

163,634

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Verical

USA . 87,500 parts In-Stock

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DigiKey

USA . 76,134 parts In-Stock

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Flip Electronics (Authorized)

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Chip1Stop

Japan . 205 parts In-Stock

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Digiode

USA . 2,350 parts In-Stock

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$0.119

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$0.119

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Nova Conductors

Japan . 15 parts In-Stock

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$0.296

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Component Electronics Inc.

Canada . 2,840 parts In-Stock

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$1.540

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$1.150

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$1.000

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Forefront Electronics and Design

USA . 46 parts In-Stock

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$2.450

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Flip Electronics

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Vyrian

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Bristol Electronics

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PC Components Company LLC

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MRC Electronics

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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Sogenti Electronics

Canada . 2,500 parts In-Stock

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Diverse Electronics

Canada . 2,500 parts In-Stock

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Legend Electronics Inc.

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Anansix

USA . 799 parts In-Stock

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M&R Communications

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ACDS - Activité Composants Distribution Service

France . 169 parts In-Stock

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Cyclops Electronics Ltd

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Speed Components Ltd

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Prism Electronics

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Goldney Electronics S.L.

Spain . 36 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,449 parts In-Stock

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$0.112

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Corohmni

South Africa . 256 parts In-Stock

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$0.125

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Ampacity Inc.

Singapore . 38,877 parts In-Stock

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Component Stockers USA

USA . 29,937 parts In-Stock

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$0.270

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$0.250

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$0.220

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Aranea Global

USA . 2,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Cyclops Electronics Ltd (Excess)

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Metaverse IC Inc.

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Authorized Procurement Solutions

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Kulean Microsystems

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Microchip USA

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SupplyDigital Components

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S.R.D Solutions

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Glotronic Ltd.

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Overview

Upgrade your electronics with the MM74HCT74MX by Onsemi, a high-quality latches & flip-flops component that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile product is perfect for a wide range of applications. With a nominal supply voltage of 5V, low propagation delay, and a maximum frequency of 21 MHz, the MM74HCT74MX provides excellent value and benefits to customers looking for top-notch electronic components. Revolutionize your projects with the MM74HCT74MX from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to impact, making the latch suitable for various applications.

Surface Mount: YES

Surface mountability allows for easy installation on circuit boards, saving space and improving efficiency in compact designs.

No. of Functions: 2

Having multiple functions in one device increases functionality and versatility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used 5V supply voltage makes integration with existing systems seamless.

Maximum Frequency At Nominal Supply: 21000000 Hz

High operating frequency allows for fast data processing and response time, suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the latch.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the latch can function reliably in a wide range of environmental conditions.

Technical Specifications

Latches & Flip-Flops MM74HCT74MX attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.625 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

44 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.753 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

21 MHz

Trade Compliance

MM74HCT74MX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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