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MLD2N06CLT4

Onsemi

MLD2N06CLT4 by Onsemi

MLD2N06CLT4 by Onsemi is a N-CHANNEL FET with 58V DS Breakdown Voltage, ideal for SWITCHING applications. It features a SINGLE configuration with built-in BIPOLAR TRANSISTOR, DIODE, and RESISTOR. With 40W Max Power Dissipation and 150 °C Max Operating Temp, it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,243 parts In-Stock

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Digiode

USA . 543 parts In-Stock

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Elcom Components

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Component Stockers USA

USA . 346 parts In-Stock

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$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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Problanco Electronics

Mexico . 5,051 parts In-Stock

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SupplyDigital Components

Austria . 4,897 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,023 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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Kulean Microsystems

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Microchip USA

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Corohmni

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Overview

Enhance your power management solutions with the MLD2N06CLT4 by Onsemi. This N-CHANNEL Power Field Effect Transistor offers unparalleled quality and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for switching applications, this transistor features a built-in bipolar transistor, diode, and resistor, providing added convenience and efficiency. With a maximum drain current of 2A and a minimum DS breakdown voltage of 58V, this transistor delivers exceptional performance in a compact and easy-to-install package. Upgrade your projects with the MLD2N06CLT4 and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the FET lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-carrying capabilities compared to P-channel FETs, making them a preferred choice for high-power applications.

Configuration: SINGLE WITH BUILT-IN BIPOLAR TRANSISTOR, DIODE AND RESISTOR

The built-in bipolar transistor, diode, and resistor allow for simplified circuit design and potentially reduce the need for additional components, saving space and cost.

Transistor Application: SWITCHING

Switching FETs are specifically designed for fast switching applications, making them suitable for applications that require high speed and efficiency.

Surface Mount: YES

Surface mount FETs are easier to assemble on PCBs, offer better heat dissipation, and have a smaller footprint compared to through-hole components.

Maximum Drain-Source On Resistance: 0.4 ohm

A lower on-resistance value means less power dissipation and higher efficiency in the FET, making it suitable for high-current applications with minimal heat generation.

Technical Specifications

Power Field Effect Transistors (FET) MLD2N06CLT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, OVERVOLTAGE CLAMPED PROTECTION

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

58 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MLD2N06CLT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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