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MLD2N06CL

Onsemi

MLD2N06CL by Onsemi

The Onsemi MLD2N06CL is a N-CHANNEL FET with 58V DS Breakdown Voltage, 40W Power Dissipation, and 0.4 ohm RDS(ON). Ideal for SWITCHING applications in ENHANCEMENT MODE operation. Features GULL WING terminals, METAL-OXIDE SEMICONDUCTOR tech, and operates up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,354 parts In-Stock

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Digiode

USA . 597 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 7,142 parts In-Stock

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TANS Electronics

Latvia . 6,449 parts In-Stock

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SupplyDigital Components

Austria . 3,173 parts In-Stock

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Corphita

USA . 775 parts In-Stock

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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Corohmni

South Africa . 325 parts In-Stock

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Problanco Electronics

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Overview

Experience the power of innovation with the MLD2N06CL by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance and reliability for all your switching needs. With a maximum operating temperature of 150 °C and a minimum DS breakdown voltage of 58V, this N-CHANNEL transistor ensures optimal efficiency and durability. Whether you're looking to enhance your electronic devices or streamline your power management systems, the MLD2N06CL delivers exceptional value and benefits that will exceed your expectations. Trust in Onsemi for cutting-edge technology that empowers you to achieve more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their low on-resistance and high efficiency, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN BIPOLAR TRANSISTOR, DIODE AND RESISTOR

Integrated components offer convenience and space-saving design, reducing the need for additional external components.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and efficient switching performance.

Surface Mount: YES

Suitable for automated manufacturing processes, allowing for easy and efficient assembly onto circuit boards.

Minimum DS Breakdown Voltage: 58 V

High breakdown voltage ensures reliable operation and protection against voltage spikes.

Avalanche Energy Rating (EAS): 80 mJ

Can withstand high energy transients, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 40 W

High power dissipation capability allows for handling higher power levels without overheating.

Maximum Operating Temperature: 150 °C

Can operate at elevated temperatures without performance degradation, suitable for industrial environments.

Maximum Drain Current (ID): 2 A

Capable of handling high current levels, making it suitable for applications requiring high current outputs.

Maximum Drain-Source On Resistance: 0.4 ohm

Low on-resistance results in lower power dissipation and increased efficiency in conducting current.

Technical Specifications

Power Field Effect Transistors (FET) MLD2N06CL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, OVERVOLTAGE CLAMPED PROTECTION

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

58 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MLD2N06CL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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