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MJE13009G

Onsemi

MJE13009G by Onsemi

MJE13009G by Onsemi is a NPN BJT transistor with 400V VCEO, 12A IC, and 2W Ptot. Ideal for switching applications due to its high power dissipation capability and low hFE of 6. Packaged in plastic/epoxy with flange mount style, it operates up to 150 °C making it suitable for various industrial uses.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,621 parts In-Stock

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Digiode

USA . 1,348 parts In-Stock

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LWI Electronics Inc

India . 83 parts In-Stock

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Huijzer Components

Netherlands . 70 parts In-Stock

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AZTECH Wire

Italy . 492 parts In-Stock

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Component Stockers USA

USA . 538 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,161 parts In-Stock

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Kepictronics

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Problanco Electronics

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TANS Electronics

Latvia . 4,546 parts In-Stock

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SupplyDigital Components

Austria . 2,508 parts In-Stock

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Corphita

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Kulean Microsystems

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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Corohmni

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Overview

Enhance your electronic designs with the MJE13009G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. The MJE13009G, part of the Power Bipolar Junction Transistors category, is perfect for switching applications thanks to its NPN polarity and 400V maximum collector-emitter voltage. With a maximum power dissipation of 2W and a peak reflow temperature of 260 °C, this transistor offers exceptional performance and durability. Trust Onsemi's expertise and elevate your projects with the MJE13009G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: NPN

Allows for efficient current flow and versatile switching capabilities.

Configuration: SINGLE

Simplifies the circuit design and installation process.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in relevant circuits.

Package Shape: RECTANGULAR

Facilitates easy placement and mounting on circuit boards.

Maximum Power Dissipation (Abs): 2 W

Can handle high power levels without overheating, ensuring stable operation.

Maximum Collector-Emitter Voltage: 400 V

Allows for operation in circuits with higher voltages, increasing versatility.

Maximum Collector Current (IC): 12 A

Capable of handling high current levels, making it suitable for various applications.

Nominal Transition Frequency (fT): 4 MHz

Provides high-frequency response, enabling fast switching speeds.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJE13009G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

LEADFORM OPTIONS ARE AVAILABLE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

6

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJE13009G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-633-7821, 5961016337821

NIIN

016337821

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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