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MCR08MT1

Onsemi

MCR08MT1 by Onsemi

MCR08MT1 by Onsemi is a single SCR with 600V repetitive peak reverse voltage and 0.8A max RMS on-state current. It is used in applications requiring high reliability and temperature range from -40 to 110 °C, making it suitable for various electronic devices.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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DF Sales Co.

USA . 344 parts In-Stock

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$0.300

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DF Sales Co.

USA . 344 parts In-Stock

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Component Electronics Inc.

Canada . 177 parts In-Stock

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$0.770

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$0.580

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$0.500

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177

$0.770

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ComSIT Distribution GmbH

Germany . 18,213 parts In-Stock

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MRC Electronics

USA . 1,000 parts In-Stock

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Electronic Expediters

USA . 1,000 parts In-Stock

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Connector Distribution Corp

USA . 1,000 parts In-Stock

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Right Parts Inc.

USA . 1,000 parts In-Stock

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EMSNET

USA . 900 parts In-Stock

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900

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ACDS - Activité Composants Distribution Service

France . 752 parts In-Stock

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752

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Bristol Electronics

USA . 752 parts In-Stock

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752

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Dan-Mar Components

USA . 752 parts In-Stock

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752

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Digiode

USA . 559 parts In-Stock

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PC Components Company LLC

USA . 510 parts In-Stock

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510

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LIBRA Elektronik GmbH

Germany . 485 parts In-Stock

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Vyrian

USA . 468 parts In-Stock

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Tectiva GmbH

Germany . 230 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 288 parts In-Stock

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$0.300

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288

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QUARKTWIN TECHNOLOGY LTD

USA . 29,417 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 5,199 parts In-Stock

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Problanco Electronics

Mexico . 5,158 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,468 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,553 parts In-Stock

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Corphita

USA . 2,309 parts In-Stock

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UHIMA Technologies

Türkiye . 797 parts In-Stock

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SupplyDigital Components

Austria . 295 parts In-Stock

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Overview

Experience the superior quality and reliability of the MCR08MT1 Silicon Controlled Rectifier by Onsemi. Designed with precision and expertise, this SCR offers exceptional performance in various applications. From industrial machinery to consumer electronics, this product delivers unmatched value and efficiency. With its advanced features and durable construction, the MCR08MT1 is the perfect choice for your next project. Trust Onsemi for top-of-the-line components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making this product suitable for various applications.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current ensures efficient control over the device, enhancing its performance.

Configuration: SINGLE

Single configuration simplifies the setup and operation of the device.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design.

Package Shape: RECTANGULAR

Rectangular shape offers ease of handling and integration into electronic circuits.

Terminal Form: GULL WING

Gull wing terminal form enables secure soldering and reliable connections.

Maximum Leakage Current: 0.2 mA

Low leakage current ensures minimal power loss and improved energy efficiency.

Repetitive Peak Reverse Voltage: 600 V

High reverse voltage capability provides protection against voltage spikes and surges.

No. of Terminals: 4

Four terminals allow for easy connectivity in electronic circuits.

Package Style: SMALL OUTLINE

Small outline package style saves space and offers compact design options.

Maximum Operating Temperature: 110 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions.

Trigger Device Type: SCR

SCR technology ensures precise and efficient triggering of the device.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables operation in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and connection options.

Maximum RMS On-state Current: 0.8 A

High maximum on-state current rating allows for handling of higher electrical loads.

Maximum DC Gate Trigger Voltage: 0.8 V

Low gate trigger voltage ensures quick and reliable device triggering.

Case Connection: ANODE

Anode case connection simplifies circuit design and operation.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating provides protection against voltage fluctuations.

Minimum Critical Rate of Rise of Off-state Voltage: 10 V/us

Minimum critical rate of rise ensures safe and reliable operation under varying voltage conditions.

Maximum Holding Current: 5 mA

High holding current ensures stable device operation under load conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 235

High peak reflow temperature capability enables reliable soldering of the device during manufacturing processes.

Technical Specifications

Silicon Controlled Rectifiers (SCR) MCR08MT1 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Maximum Leakage Current:

.2 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

600 V

Repetitive Peak Reverse Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

SCR

Trade Compliance

MCR08MT1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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