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MCR08BT1

Onsemi

MCR08BT1 by Onsemi

MCR08BT1 by Onsemi is a single SCR with a max RMS on-state current of 0.8A and repetitive peak reverse voltage of 200V. It is used in applications requiring a small outline package, such as power supplies and motor control systems.

Median Price

$0.362

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 1,080 parts In-Stock

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$0.600

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DF Sales Co.

USA . 1,080 parts In-Stock

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Digiode

USA . 3,498 parts In-Stock

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Vyrian

USA . 3,214 parts In-Stock

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Anansix

USA . 1,967 parts In-Stock

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Semtec, LLC

USA . 1,614 parts In-Stock

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PC Components Company LLC

USA . 1,000 parts In-Stock

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Micros

Poland . 1,000 parts In-Stock

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$0.124

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$0.124

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Bristol Electronics

USA . 1,000 parts In-Stock

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Partservice

France . 1,000 parts In-Stock

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$0.112

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$0.112

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$0.112

ACDS - Activité Composants Distribution Service

France . 952 parts In-Stock

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ComSIT Distribution GmbH

Germany . 945 parts In-Stock

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Microfarads

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R&J Components

USA . 890 parts In-Stock

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Florida Circuit

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Mil-Aero Solutions, Inc.

USA . 385 parts In-Stock

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Beltway Electronics Company

USA . 285 parts In-Stock

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Inventory MP

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MISTER SPROCKETS

USA . 114 parts In-Stock

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Legend Electronics Inc.

USA . 17 parts In-Stock

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Speed Components Ltd

Israel . 5 parts In-Stock

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Semi Source

USA . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 394 parts In-Stock

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$0.110

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394

$0.110

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One Stop Electronics

USA . 1,626 parts In-Stock

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$17.100

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Ampacity Inc.

Singapore . 1,040 parts In-Stock

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$23.100

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Perfect Parts

USA . 275,520 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

USA . 9,192 parts In-Stock

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UNI Independent Distributors

Spain . 8,121 parts In-Stock

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Assy Fe

Spain . 8,091 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Problanco Electronics

Mexico . 6,218 parts In-Stock

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SupplyDigital Components

Austria . 5,650 parts In-Stock

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TANS Electronics

Latvia . 5,445 parts In-Stock

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Corphita

USA . 4,373 parts In-Stock

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Kulean Microsystems

USA . 2,125 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 952 parts In-Stock

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Glotronic Ltd.

UK . 762 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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GreenTree Electronics

Israel . 339 parts In-Stock

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Overview

Unleash the power of advanced technology with the MCR08BT1 by Onsemi, a top-tier Silicon Controlled Rectifier that guarantees superior quality and performance. From its durable plastic/epoxy construction to its single configuration and gull wing terminal form, this SCR is designed to exceed expectations. Perfect for a wide range of applications, this small outline package offers customers maximum value with its high on-state current, low leakage current, and reliable trigger voltage. Experience innovation like never before with the MCR08BT1 - the ultimate solution for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures lightweight and durable construction.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current allows for efficient control and operation of the SCR.

Configuration: SINGLE

Single configuration simplifies installation and integration of the SCR in various electronic circuits.

Surface Mount: YES

Surface mount capability enables easy PCB mounting, saving space and time during assembly.

Maximum Leakage Current: 0.2 mA

Low leakage current ensures minimal power loss and improves overall efficiency of the SCR.

Repetitive Peak Reverse Voltage: 200 V

High reverse voltage rating makes the SCR suitable for applications requiring voltage rectification.

No. of Terminals: 4

4 terminals provide flexibility in connecting the SCR to external circuits for different applications.

Trigger Device Type: SCR

Being an SCR, this device offers reliable and efficient switching for various power control applications.

Maximum RMS On-state Current: 0.8 A

High on-state current rating allows the SCR to handle heavy loads without overheating.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the SCR to function in harsh environmental conditions.

Maximum Operating Temperature: 110 °C

High temperature tolerance ensures reliable performance even in elevated temperature environments.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature of 235 °C ensures proper soldering and mounting of the SCR onto the PCB.

Technical Specifications

Silicon Controlled Rectifiers (SCR) MCR08BT1 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Maximum Leakage Current:

.2 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

200 V

Repetitive Peak Reverse Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

SCR

Trade Compliance

MCR08BT1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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