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MCH6660-TL-H

Onsemi

MCH6660-TL-H by Onsemi

MCH6660-TL-H by Onsemi is a Small Signal FET with N/P-Channel, 2 elements w/ diode. It operates in enhancement mode for switching applications. Features include 20V DS breakdown voltage, 0.136 ohm RDS(on), and 2A max drain current. Ideal for surface mount designs with a temp range up to 150°C.

Median Price

$0.198

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,597,513 parts In-Stock

1+ parts

-

100+ parts

$0.198

1k+ parts

$0.164

10k+ parts

$0.147

1,597,513

-

$0.198

$0.164

$0.147

DigiKey

USA . 1,597,513 parts In-Stock

1+ parts

-

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$0.250

1,597,513

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$0.250

Verical

USA . 1,596,352 parts In-Stock

1+ parts

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$0.183

1,596,352

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$0.183

Distributors (In-Stock)

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Digiode

USA . 2,464 parts In-Stock

1+ parts

$0.155

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2,464

$0.155

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Vyrian

USA . 1,999 parts In-Stock

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$0.163

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1,999

$0.163

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Bristol Electronics

USA . 1,066 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

1k+ parts

$0.150

10k+ parts

-

1,066

$0.750

$0.375

$0.150

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ACDS - Activité Composants Distribution Service

France . 1,166 parts In-Stock

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Dan-Mar Components

USA . 1,066 parts In-Stock

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1,066

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QIE Inc.

USA . 85 parts In-Stock

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85

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,697,120 parts In-Stock

1+ parts

$0.139

100+ parts

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1,697,120

$0.139

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Corphita

USA . 1,438 parts In-Stock

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$0.147

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1,438

$0.147

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Corohmni

South Africa . 55 parts In-Stock

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$0.163

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55

$0.163

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Component Stockers USA

USA . 2,257,438 parts In-Stock

1+ parts

$0.170

100+ parts

$0.160

1k+ parts

$0.140

10k+ parts

$0.140

2,257,438

$0.170

$0.160

$0.140

$0.140

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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TANS Electronics

Latvia . 7,067 parts In-Stock

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SupplyDigital Components

Austria . 6,465 parts In-Stock

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Problanco Electronics

Mexico . 6,204 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,429 parts In-Stock

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Kulean Microsystems

USA . 5,178 parts In-Stock

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Perfect Parts

USA . 3,306 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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UHIMA Technologies

Türkiye . 596 parts In-Stock

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596

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Overview

Enhance your electronics projects with the MCH6660-TL-H Small Signal Field Effect Transistor by Onsemi. Manufactured with top-quality materials and advanced technology, this transistor offers superior performance in switching applications. Its N-Channel and P-Channel configuration with built-in diode provides added versatility and efficiency. With a low on resistance and high breakdown voltage, this transistor delivers reliable operation at high temperatures. Trust Onsemi for innovative solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for greater flexibility in circuit design and application.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it efficient and reliable for such tasks.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without issues.

Surface Mount: YES

Surface mount capability makes it easier to integrate into circuit boards, saving space and improving overall design aesthetics.

Maximum Drain Current (ID): 2 A

Capable of handling a maximum drain current of 2A, making it suitable for applications that require higher current loads.

Maximum Drain-Source On Resistance: 0.136 ohm

Low on-resistance ensures minimal power loss and efficient performance during operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) MCH6660-TL-H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.136 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MCH6660-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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