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MCH6627

Onsemi

MCH6627 by Onsemi

MCH6627 by Onsemi is a Small Signal FET with N/P-Channel types, ideal for switching applications. It features 2 elements with built-in diode, operating in depletion mode. With a max drain current of 1.4A and low on-resistance of 0.3 ohm, it offers high performance in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,378 parts In-Stock

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Vyrian

USA . 789 parts In-Stock

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Kulean Microsystems

USA . 3,426 parts In-Stock

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Corphita

USA . 1,615 parts In-Stock

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Problanco Electronics

Mexico . 1,459 parts In-Stock

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TANS Electronics

Latvia . 926 parts In-Stock

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UHIMA Technologies

Türkiye . 734 parts In-Stock

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SupplyDigital Components

Austria . 697 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Upgrade your electronics with the MCH6627 by Onsemi! This high-quality Small Signal Field Effect Transistor offers N-channel and P-channel configurations with built-in diodes for efficient switching applications. With a minimum DS breakdown voltage of 30V and maximum drain current of 1.4A, this transistor provides reliable performance in a compact rectangular package. Experience the benefits of Onsemi's advanced technology and maximize your circuit design possibilities with the MCH6627. Elevate your projects with ease and precision - get yours today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for versatile circuit design and compatibility with different applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diode enhances the functionality and performance of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Surface Mount: YES

Makes it easy to mount on a circuit board, saving space and allowing for automated assembly.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without failure.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and packaging.

Operating Mode: DEPLETION MODE

The depletion mode operation ensures that the transistor is normally on and only turns off with a control signal, making it suitable for certain applications.

Maximum Drain Current (Abs) (ID): 1 A

Capable of handling a high drain current, making it suitable for various applications that require high current switching.

No. of Terminals: 6

Having 6 terminals provides flexibility in connectivity and allows for more complex circuit configurations.

Maximum Power Dissipation (Abs): 0.8 W

With a high power dissipation rating, this transistor can handle higher power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology provides high efficiency and fast switching speeds for better overall performance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without degrading performance, making it suitable for harsh environments.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability and performance in electronic devices.

Maximum Drain-Source On Resistance: 0.3 ohm

With low on-resistance, this transistor minimizes power loss and heat dissipation, improving overall efficiency.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit layout and connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) MCH6627 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1.4 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MCH6627 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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