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MC74VHCT374ADWRG

Onsemi

MC74VHCT374ADWRG by Onsemi

MC74VHCT374ADWRG by Onsemi is an 8-bit bus driver with 11.5ns propagation delay at 5V, suitable for industrial applications. It features a small outline package, operates b/w -40 to 85 °C, and supports a max frequency of 95MHz. Ideal for systems requiring fast signal transmission in compact spaces.

Median Price

$0.641

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 11,000 parts In-Stock

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Arrow

USA . 2,000 parts In-Stock

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$0.641

10k+ parts

$0.415

2,000

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$0.641

$0.415

Verical

USA . 2,000 parts In-Stock

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$0.641

10k+ parts

$0.415

2,000

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$0.641

$0.415

Distributors (In-Stock)

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Digiode

USA . 1,967 parts In-Stock

1+ parts

$0.940

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$0.940

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Flip Electronics

USA . 8,000 parts In-Stock

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Vyrian

USA . 5,668 parts In-Stock

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5,668

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Distributors (Availability)

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Corphita

USA . 711 parts In-Stock

1+ parts

$0.891

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711

$0.891

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$0.990

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71

$0.990

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Component Stockers USA

USA . 7,518 parts In-Stock

1+ parts

$4.910

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7,518

$4.910

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TANS Electronics

Latvia . 8,220 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,683 parts In-Stock

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7,683

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Microchip USA

USA . 5,874 parts In-Stock

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SupplyDigital Components

Austria . 3,995 parts In-Stock

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Kulean Microsystems

USA . 3,534 parts In-Stock

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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285

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Problanco Electronics

Mexico . 257 parts In-Stock

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Overview

Enhance your electronic designs with the MC74VHCT374ADWRG by Onsemi, a top-of-the-line Bus Driver & Transceiver. Manufactured with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this component provides seamless integration and efficient performance. With a nominal supply voltage of 5V and a maximum operating temperature of 85 °C, customers can trust in the durability and longevity of this device. Experience the value and benefits that this innovative product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto a circuit board, saving space and making the assembly process more efficient.

No. of Bits: 8

8 bits provide sufficient data capacity for various communication protocols, making this product versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage ensures compatibility with common electronic systems, making it easy to incorporate this product into existing setups.

Output Characteristics: 3-STATE

3-state output allows for multiple bus drivers to share a common bus line without interference, enhancing the flexibility and scalability of the system.

Maximum Frequency At Nominal Supply: 95000000 Hz

High maximum frequency capability enables fast data transmission rates, making this product suitable for demanding applications that require quick communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for continuous operation.

Technical Specifications

Bus Driver & Transceivers MC74VHCT374ADWRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

95000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

MC74VHCT374ADWRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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