Loading...

MC74VHCT259AMG

Onsemi

MC74VHCT259AMG by Onsemi

MC74VHCT259AMG by Onsemi is an 8-bit decoder with 11.5ns propagation delay at 5V, suitable for military applications. It features a small outline package, true output polarity, and can operate b/w -55 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,980

-

-

-

-

Digiode

USA . 1,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,567

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

-

10k+ parts

-

798

$12.460

-

-

-

SupplyDigital Components

Austria . 4,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,245

-

-

-

-

TANS Electronics

Latvia . 3,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,447

-

-

-

-

Corphita

USA . 1,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,885

-

-

-

-

Problanco Electronics

Mexico . 1,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,385

-

-

-

-

Kulean Microsystems

USA . 789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

789

-

-

-

-

UHIMA Technologies

Türkiye . 526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

526

-

-

-

-

Microchip USA

USA . 371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

371

-

-

-

-

Corohmni

South Africa . 159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

159

-

-

-

-

Overview

Enhance your electronic projects with the MC74VHCT259AMG by Onsemi, a top-tier manufacturer known for their high-quality components. As part of the Decoder & Drivers category, this product offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. With 8 bits and a nominal supply voltage of 5V, customers can expect reliable performance and efficiency. Say goodbye to delays and hello to seamless operation with the MC74VHCT259AMG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast response times, making it suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various input signals.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design for space-constrained applications.

No. of Bits: 8

8 bits allow for a wide range of decoding and driving capabilities.

Nominal Supply Voltage / Vsup (V): 5

Stable 5V supply voltage ensures reliable operation.

Load Capacitance (CL): 50 pF

Low load capacitance minimizes signal distortion and interference.

Power Supplies (V): 5

Multiple power supplies at 5V cater to various requirements.

No. of Terminals: 16

Sufficient terminals for easy connectivity and integration with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on PCBs and allows for high-density mounting.

Maximum I (ol): 8 Amp

High output current capability enables driving of power-hungry loads.

Propagation Delay (tpd): 18 ns

Low propagation delay ensures fast signal processing and reduces latency.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes the product suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable electrical connections and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and component placement.

Maximum Seated Height: 1.2 mm

Low seated height minimizes space requirements and allows for compact device designs.

Width: 4.4 mm

Narrow width enables efficient use of space on the PCB.

Output Polarity: TRUE

True output polarity simplifies signal interpretation and integration with other components.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature makes the product suitable for lead-free soldering processes.

Length: 5 mm

Compact length allows for space-saving PCB layouts.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mount soldering and strong mechanical connection.

Packing Method: RAIL

Rail packing method allows for easy handling and storage of multiple components.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures compatibility with a wide range of power sources.

Technical Specifications

Decoder & Drivers MC74VHCT259AMG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHCT/VHCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74VHCT259AMG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20