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MC74VHCT139ADTR2G

Onsemi

MC74VHCT139ADTR2G by Onsemi

MC74VHCT139ADTR2G by Onsemi is a CMOS Decoder & Drivers with 10.5 ns Propagation Delay, 5V Nominal Voltage, and 50 pF Load Capacitance. It has 16 terminals in a SMALL OUTLINE package suitable for military applications requiring dual terminal position and operating temperatures from -55 to 125 °C.

Median Price

$0.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,998 parts In-Stock

1+ parts

$0.540

100+ parts

$0.293

1k+ parts

$0.252

10k+ parts

$0.232

4,998

$0.540

$0.293

$0.252

$0.232

Mouser Electronics

USA . 2,490 parts In-Stock

1+ parts

$0.540

100+ parts

$0.294

1k+ parts

$0.253

10k+ parts

$0.230

2,490

$0.540

$0.294

$0.253

$0.230

Distributors (In-Stock)

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Flip Electronics

USA . 35,000 parts In-Stock

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35,000

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Vyrian

USA . 3,059 parts In-Stock

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3,059

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Digiode

USA . 1,859 parts In-Stock

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1,859

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AZTECH Wire

Italy . 605 parts In-Stock

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$15.680

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605

$15.680

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Kulean Microsystems

USA . 6,852 parts In-Stock

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6,852

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Problanco Electronics

Mexico . 6,355 parts In-Stock

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TANS Electronics

Latvia . 4,849 parts In-Stock

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Microchip USA

USA . 3,154 parts In-Stock

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SupplyDigital Components

Austria . 2,448 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,135 parts In-Stock

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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Corphita

USA . 464 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MC74VHCT139ADTR2G by Onsemi. As a leader in the industry, Onsemi delivers top-quality decoder & drivers that are perfect for a wide range of applications. With a fast propagation delay and high load capacitance, this product offers superior performance and reliability. Whether you're a hobbyist or a professional, this decoder & driver will provide you with the value, benefits, and advantages you need to take your projects to the next level. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to external factors, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures quick response time, making the product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic circuits, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single device increases versatility and functionality, making the product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes the product compatible with a wide range of electronic systems and power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable operation and compatibility with different types of electronic components, enhancing overall performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to function reliably in various environmental conditions, increasing its versatility and durability.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the product can withstand extreme cold conditions, making it suitable for a wide range of applications.

Technical Specifications

Decoder & Drivers MC74VHCT139ADTR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Qualification:

Not Qualified

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

MC74VHCT139ADTR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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