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MC74VHCT125AMEL

Onsemi

MC74VHCT125AMEL by Onsemi

MC74VHCT125AMEL by Onsemi is a 4-function bus driver with 10.5ns propagation delay at 5V supply voltage. It features 3-STATE output characteristics and operates in a temperature range of -55 to 125 °C. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,221 parts In-Stock

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Digiode

USA . 2,009 parts In-Stock

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AZTECH Wire

Italy . 172 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,273 parts In-Stock

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Problanco Electronics

Mexico . 5,696 parts In-Stock

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Microchip USA

USA . 4,339 parts In-Stock

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SupplyDigital Components

Austria . 3,410 parts In-Stock

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TANS Electronics

Latvia . 2,297 parts In-Stock

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Kulean Microsystems

USA . 1,961 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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Corohmni

South Africa . 253 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHCT125AMEL by Onsemi! As a reputable manufacturer in the industry, Onsemi delivers top-notch quality products that guarantee reliable performance. This bus driver & transceiver is versatile and ideal for a wide range of applications. With fast propagation delay, low power consumption, and 3-state output characteristics, this component offers exceptional value to customers. Trust Onsemi to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 10.5 ns

The fast propagation delay ensures efficient and reliable data transmission in the bus driver & transceiver.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design in electronic applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common and widely supported power requirement for many electronic devices, making integration easier.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and organization of components on a circuit board.

Output Polarity: TRUE

The true output polarity ensures consistent and accurate signal transmission in the bus driver & transceiver.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of input signals.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers MC74VHCT125AMEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.65 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT125AMEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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