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MC74VHC259D

Onsemi

MC74VHC259D by Onsemi

MC74VHC259D by Onsemi is an 8-bit decoder with 11.5ns propagation delay, suitable for military applications. It operates at a supply voltage range of 2-5.5V and has a max operating temperature of 125 °C. With GULL WING terminals and small outline package style, it offers fast decoding in compact designs.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

480

-

$0.119

$0.099

$0.088

Distributors (In-Stock)

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Digiode

USA . 74 parts In-Stock

1+ parts

$0.093

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74

$0.093

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Vyrian

USA . 4,259 parts In-Stock

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4,259

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R&J Components

USA . 1,166 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,443 parts In-Stock

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$0.088

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$0.088

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Corohmni

South Africa . 350 parts In-Stock

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$0.098

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350

$0.098

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AZTECH Wire

Italy . 307 parts In-Stock

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$17.680

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307

$17.680

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Component Stockers USA

USA . 374 parts In-Stock

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$99.990

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374

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TANS Electronics

Latvia . 7,243 parts In-Stock

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SupplyDigital Components

Austria . 2,059 parts In-Stock

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Kulean Microsystems

USA . 1,814 parts In-Stock

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Problanco Electronics

Mexico . 1,499 parts In-Stock

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UHIMA Technologies

Türkiye . 735 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the MC74VHC259D by Onsemi, a top-tier Decoder & Driver that guarantees superior performance and reliability. Crafted by industry leader Onsemi, this decoder offers unparalleled quality and precision in decoding applications. With a compact design and fast propagation delay of 11.5 ns, the MC74VHC259D is perfect for a wide range of projects. Trust in Onsemi's reputation for excellence and choose this product for seamless integration and optimal results. Upgrade your designs today with the MC74VHC259D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and helps protect the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast processing of signals, making this decoder & driver suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a nominal supply voltage of 3.3V, making it suitable for low-power applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this decoder & driver can withstand high temperature environments, increasing its versatility.

Technical Specifications

Decoder & Drivers MC74VHC259D attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

ADDRESS LATCHES

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74VHC259D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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