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MC74VHC1G126DF1G

Onsemi

MC74VHC1G126DF1G by Onsemi

MC74VHC1G126DF1G by Onsemi is a 3-STATE bus driver with 10.5ns propagation delay, suitable for military applications. It operates at -55 to 125 °C, has a load capacitance of 50pF, and supports power supplies from 2V to 5.5V. The package is small outline with dual terminals and GULL WING finish for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,081 parts In-Stock

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Digiode

USA . 2,471 parts In-Stock

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Nova Conductors

Japan . 96 parts In-Stock

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AZTECH Wire

Italy . 89 parts In-Stock

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$5.066

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Semicontronic

India . 1,095 parts In-Stock

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$34.000

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$33.150

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$32.980

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Ampacity Inc.

Singapore . 437 parts In-Stock

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$55.000

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Kulean Microsystems

USA . 7,894 parts In-Stock

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TANS Electronics

Latvia . 7,308 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,697 parts In-Stock

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 3,717 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

Austria . 1,779 parts In-Stock

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Aranea Global

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UHIMA Technologies

Türkiye . 604 parts In-Stock

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Corphita

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Corohmni

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Microchip USA

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Overview

Unlock the power of seamless communication with the MC74VHC1G126DF1G by Onsemi. Crafted with precision and expertise, this bus driver & transceiver ensures fast and reliable data transmission in a compact package. Ideal for a range of applications, this product boasts a low propagation delay and high output current, making it a versatile solution for your connectivity needs. Trust in Onsemi's reputation for excellence and invest in a product that delivers unparalleled value and performance to customers. Elevate your projects with the MC74VHC1G126DF1G and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capabilities allow for easy and efficient installation on circuit boards, saving time and space.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and allows for a compact design.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable operation and minimal signal distortion.

Power Supplies (V): 2/5.5

Wide range of power supply voltage (2V to 5.5V) provides flexibility in different operating environments.

No. of Terminals: 5

Optimal number of terminals for a bus driver & transceiver, simplifying connections and reducing complexity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with small outline and thin profile offers space-saving benefits and ease of integration into various electronic devices.

Maximum I (ol): 8 Amp

High output current capability (8 Amp) allows for driving heavy loads with ease, making this product suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output characteristics enable tri-state operation, providing additional flexibility in controlling the output signals.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature makes this product suitable for use in extreme cold environments.

Terminal Finish: TIN

Tin terminal finish ensures good electrical conductivity and corrosion resistance, enhancing the overall reliability of the product.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and better connectivity in various circuit configurations.

Output Polarity: TRUE

True output polarity ensures correct signal alignment, preventing signal distortion and improving overall system performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering during the assembly process, ensuring a robust connection.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and suitability for rugged and demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during the manufacturing process, ensuring high-quality connections.

Packing Method: TR

TR (Tape and Reel) packing method provides convenience for automated assembly processes, increasing efficiency and reducing handling errors.

Terminal Pitch: 0.635 mm

Optimal terminal pitch of 0.635 mm allows for compact design layouts and precise connections, enhancing overall reliability.

Control Type: ENABLE HIGH

Enable high control type offers flexible enable/disable functionality, allowing for efficient management of the device's operation.

Technical Specifications

Bus Driver & Transceivers MC74VHC1G126DF1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

MC74VHC1G126DF1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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