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MC74VHC1G125DF1G

Onsemi

MC74VHC1G125DF1G by Onsemi

MC74VHC1G125DF1G by Onsemi is a 3.3V bus driver with 16ns propagation delay, operating b/w -55 to 125 °C. It features a small outline package with dual terminals and true output polarity. Ideal for military-grade applications requiring compact design and fast signal transmission.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,801 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

4,801

-

$0.079

$0.066

$0.059

Verical

USA . 4,801 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.082

4,801

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-

-

$0.082

Distributors (In-Stock)

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Digiode

USA . 2,421 parts In-Stock

1+ parts

$0.062

100+ parts

-

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2,421

$0.062

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Vyrian

USA . 8,357 parts In-Stock

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8,357

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Distributors (Availability)

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Corphita

USA . 1,913 parts In-Stock

1+ parts

$0.058

100+ parts

-

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1,913

$0.058

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-

Corohmni

South Africa . 430 parts In-Stock

1+ parts

$0.065

100+ parts

-

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430

$0.065

-

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AZTECH Wire

Italy . 1,076 parts In-Stock

1+ parts

$8.210

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1,076

$8.210

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Kulean Microsystems

USA . 5,731 parts In-Stock

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5,731

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Continental Prestige Electronics

USA . 4,801 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.056

10k+ parts

-

4,801

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-

$0.056

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Microchip USA

USA . 4,316 parts In-Stock

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4,316

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SupplyDigital Components

Austria . 4,194 parts In-Stock

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4,194

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TANS Electronics

Latvia . 2,558 parts In-Stock

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2,558

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Problanco Electronics

Mexico . 934 parts In-Stock

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934

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UHIMA Technologies

Türkiye . 864 parts In-Stock

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864

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Kepictronics

USA . 620 parts In-Stock

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Overview

Discover the power of seamless communication with the MC74VHC1G125DF1G by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability for a wide range of applications. With its compact design and advanced features, this product provides exceptional value and benefits to customers. Experience fast propagation delay, high temperature tolerance, and true output polarity, all in a sleek package that is sure to exceed your expectations. Elevate your projects with the trusted technology of Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for use in a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and space in the overall design.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures efficient power consumption and compatibility with a wide range of systems.

Propagation Delay (tpd): 16 ns

With a low propagation delay of 16ns, this product ensures fast and efficient signal transmission, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows for reliable performance even in harsh environments, ensuring longevity and durability of the product.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signals, making this product versatile and suitable for various applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and compatibility with a wide range of systems, making this product energy-efficient and cost-effective.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage levels, making it suitable for a variety of power supply configurations.

Technical Specifications

Bus Driver & Transceivers MC74VHC1G125DF1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MC74VHC1G125DF1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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