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MC74LCX245MG

Onsemi

MC74LCX245MG by Onsemi

MC74LCX245MG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage of 2.5V to 3.3V. It features a propagation delay of 7ns and can withstand temperatures from -55 °C to 125°C. Ideal for bidirectional control applications in military-grade systems due to its compact size and dual terminal position.

Median Price

$0.521

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

960

-

$0.502

$0.417

$0.371

DigiKey

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

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$0.630

10k+ parts

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960

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-

$0.630

-

Verical

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

960

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 167 parts In-Stock

1+ parts

$0.391

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167

$0.391

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Vyrian

USA . 3,977 parts In-Stock

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3,977

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Distributors (Availability)

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Corphita

USA . 2,158 parts In-Stock

1+ parts

$0.371

100+ parts

-

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2,158

$0.371

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Corohmni

South Africa . 256 parts In-Stock

1+ parts

$0.412

100+ parts

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256

$0.412

-

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Component Stockers USA

USA . 917 parts In-Stock

1+ parts

$0.430

100+ parts

$0.400

1k+ parts

-

10k+ parts

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917

$0.430

$0.400

-

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AZTECH Wire

Italy . 1,145 parts In-Stock

1+ parts

$10.800

100+ parts

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1,145

$10.800

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TANS Electronics

Latvia . 6,360 parts In-Stock

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6,360

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Kulean Microsystems

USA . 5,533 parts In-Stock

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5,533

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SupplyDigital Components

Austria . 3,691 parts In-Stock

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Problanco Electronics

Mexico . 3,110 parts In-Stock

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Andel Nordic

Denmark . 1,664 parts In-Stock

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1,664

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Continental Prestige Electronics

USA . 960 parts In-Stock

1+ parts

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100+ parts

$0.357

1k+ parts

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960

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$0.357

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UHIMA Technologies

Türkiye . 729 parts In-Stock

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729

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Microchip USA

USA . 191 parts In-Stock

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191

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Overview

Discover the top-quality MC74LCX245MG by Onsemi, a versatile bus driver & transceiver perfect for various applications. With Onsemi's reputation for excellence in manufacturing, this product offers unmatched reliability and performance. Experience seamless data transmission with a propagation delay of just 7 ns, making it ideal for fast-paced environments. The compact package design ensures easy integration, while the 3-STATE output characteristics provide added flexibility. Trust Onsemi to deliver value through innovation and superior quality with the MC74LCX245MG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for handling in various environments.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making the product suitable for compact designs.

Package Shape: RECTANGULAR

Rectangular package shape provides easy integration and mounting on PCBs, ensuring a streamlined design layout.

Nominal Supply Voltage / Vsup (V): 2.5

Low nominal supply voltage ensures energy efficiency and low power consumption, making the product suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to perform reliably in harsh environmental conditions, enhancing its durability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for data transmission.

Technical Specifications

Bus Driver & Transceivers MC74LCX245MG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

5.275 mm

Trade Compliance

MC74LCX245MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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