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MC74LCX16245DTRG

Onsemi

MC74LCX16245DTRG by Onsemi

MC74LCX16245DTRG by Onsemi is a 48-terminal bus driver with 4.5ns propagation delay, suitable for industrial applications. It operates at 2.5V nominal voltage and supports up to 3.6V max supply voltage, featuring a compact rectangular package style with true output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,616 parts In-Stock

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Digiode

USA . 1,552 parts In-Stock

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Speed Components Ltd

Israel . 82 parts In-Stock

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AZTECH Wire

Italy . 905 parts In-Stock

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$19.870

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905

$19.870

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Component Stockers USA

USA . 447 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,443 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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TANS Electronics

Latvia . 2,690 parts In-Stock

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SupplyDigital Components

Austria . 2,633 parts In-Stock

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Problanco Electronics

Mexico . 2,587 parts In-Stock

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Corphita

USA . 2,051 parts In-Stock

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Microchip USA

USA . 484 parts In-Stock

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UHIMA Technologies

Türkiye . 328 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Discover the power of seamless data transmission with the MC74LCX16245DTRG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers and transceivers that guarantee reliability and efficiency. This innovative product is designed for a wide range of applications, providing a versatile solution for your electronic needs. With fast propagation delay and a compact design, the MC74LCX16245DTRG offers exceptional performance while maintaining ease of use. Upgrade your systems with this cutting-edge technology and experience the advantages it brings to your projects. Elevate your electronics with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the bus driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay allows for fast signal transmission, making this bus driver ideal for high-speed communication applications.

Surface Mount: YES

Surface mount design enables easy and compact integration of the bus driver into circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component simplifies the circuit design and reduces the number of external components needed.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low supply voltage of 2.5V allows for compatibility with a wide range of systems while also minimizing power consumption.

Output Characteristics: 3-STATE

The 3-state output feature allows the bus driver to disconnect from the bus line when not actively transmitting data, reducing interference and power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver suitable for battery-operated devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers MC74LCX16245DTRG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Translation:

N/A

Width:

6.1 mm

Trade Compliance

MC74LCX16245DTRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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