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MC74HCT541ANG

Onsemi

MC74HCT541ANG by Onsemi

MC74HCT541ANG by Onsemi is an 8-bit bus driver with 32ns propagation delay at 5V. It features a 3-STATE output and operates b/w -55°C to 125°C. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,691 parts In-Stock

1+ parts

$0.440

100+ parts

$0.430

1k+ parts

$0.420

10k+ parts

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19,691

$0.440

$0.430

$0.420

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Distributors (In-Stock)

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Digiode

USA . 982 parts In-Stock

1+ parts

$0.418

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-

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982

$0.418

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Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$0.481

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34

$0.481

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Vyrian

USA . 7,615 parts In-Stock

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7,615

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South Electronics

USA . 175 parts In-Stock

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175

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Semtec, LLC

USA . 123 parts In-Stock

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123

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Distributors (Availability)

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Corphita

USA . 404 parts In-Stock

1+ parts

$0.396

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404

$0.396

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Corohmni

South Africa . 427 parts In-Stock

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$0.440

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427

$0.440

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AZTECH Wire

Italy . 1,137 parts In-Stock

1+ parts

$15.140

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1,137

$15.140

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Continental Prestige Electronics

USA . 19,691 parts In-Stock

1+ parts

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100+ parts

$0.432

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19,691

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$0.432

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TANS Electronics

Latvia . 7,340 parts In-Stock

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7,340

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Kulean Microsystems

USA . 5,905 parts In-Stock

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5,905

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Problanco Electronics

Mexico . 4,974 parts In-Stock

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4,974

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Microchip USA

USA . 306 parts In-Stock

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306

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SupplyDigital Components

Austria . 296 parts In-Stock

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296

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UHIMA Technologies

Türkiye . 149 parts In-Stock

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149

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Overview

Enhance your electronic projects with the MC74HCT541ANG by Onsemi, a top-quality bus driver & transceiver that offers reliable performance and versatility. Onsemi is a trusted manufacturer known for producing high-quality components, ensuring the durability and efficiency of this product. With a 3-state output and 8-bit design, this component is perfect for applications requiring seamless data transmission. Experience the benefits of quick propagation delay, low power consumption, and a wide operating temperature range, making it a valuable addition to any project. Upgrade your circuits with the MC74HCT541ANG and enjoy enhanced functionality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 32 ns

The low propagation delay ensures quick and efficient signal transmission, making this product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides stable power to the product, ensuring reliable operation.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexibility in controlling the output signal, adding versatility to the product.

Temperature Grade: MILITARY

The MILITARY grade temperature range ensures the product can withstand harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it energy efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74HCT541ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HCT541ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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