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MC74HCT541ADTR2

Onsemi

MC74HCT541ADTR2 by Onsemi

MC74HCT541ADTR2 by Onsemi is an 8-bit bus driver with 32ns propagation delay at 5V. It features a small outline package and operates in temperatures ranging from -55 to 125 °C. Ideal for applications requiring true output polarity and dual terminal position control.

Median Price

$0.225

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

1,220

-

$0.225

$0.186

$0.166

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,440 parts In-Stock

1+ parts

$0.175

100+ parts

-

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1,440

$0.175

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Vyrian

USA . 6,751 parts In-Stock

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6,751

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Greenchips

USA . 2,140 parts In-Stock

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2,140

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Chip Stock

USA . 142 parts In-Stock

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142

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Distributors (Availability)

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Corphita

USA . 617 parts In-Stock

1+ parts

$0.166

100+ parts

-

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617

$0.166

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Corohmni

South Africa . 383 parts In-Stock

1+ parts

$0.184

100+ parts

-

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383

$0.184

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Component Stockers USA

USA . 1,320 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

-

1,320

$0.190

$0.180

$0.160

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AZTECH Wire

Italy . 135 parts In-Stock

1+ parts

$9.930

100+ parts

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135

$9.930

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Problanco Electronics

Mexico . 7,792 parts In-Stock

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7,792

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Kulean Microsystems

USA . 7,594 parts In-Stock

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TANS Electronics

Latvia . 4,234 parts In-Stock

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SupplyDigital Components

Austria . 3,352 parts In-Stock

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Continental Prestige Electronics

USA . 1,220 parts In-Stock

1+ parts

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100+ parts

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$0.160

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1,220

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$0.160

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UHIMA Technologies

Türkiye . 959 parts In-Stock

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959

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Microchip USA

USA . 306 parts In-Stock

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306

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Overview

Discover the MC74HCT541ADTR2 by Onsemi, a top-quality Bus Driver & Transceiver that offers reliable performance and versatility. With Onsemi's reputation for excellence in manufacturing, this product ensures superior functionality and durability. Ideal for a wide range of applications, this 8-bit device provides customers with unmatched value and benefits. Experience fast propagation delay, low power consumption, and ease of installation with the MC74HCT541ADTR2. Upgrade your projects today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures efficient signal transmission and quick response times in Bus Driver applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on a PCB.

No. of Bits: 8

8 bits offer versatility in data transmission and processing, suitable for various bus communication needs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with many systems and easy to integrate.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, reducing power consumption and signal interference.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for bus driver applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in challenging environmental conditions.

Technical Specifications

Bus Driver & Transceivers MC74HCT541ADTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74HCT541ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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