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MC74HCT138ANG

Onsemi

MC74HCT138ANG by Onsemi

MC74HCT138ANG by Onsemi is a 16-terminal CMOS decoder with 45ns propagation delay at 5V. It has inverted output polarity and operates b/w -55 to 125 °C. Ideal for military-grade applications requiring standard input conditioning and 50pF load capacitance.

Median Price

$34.344

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 300 parts In-Stock

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$34.344

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$31.253

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$28.162

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300

$34.344

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$28.162

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Digiode

USA . 989 parts In-Stock

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$32.627

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989

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Vyrian

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AZTECH Wire

Italy . 1,043 parts In-Stock

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Corphita

USA . 1,178 parts In-Stock

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Corohmni

South Africa . 452 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$34.344

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$31.253

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$28.162

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$34.344

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$28.162

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Component Stockers USA

USA . 341 parts In-Stock

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$99.990

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Kulean Microsystems

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Problanco Electronics

Mexico . 5,214 parts In-Stock

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UHIMA Technologies

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TANS Electronics

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Microchip USA

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SupplyDigital Components

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Overview

Get ready to experience top-notch quality and performance with the MC74HCT138ANG decoder & driver by Onsemi. Known for their superior manufacturing standards, Onsemi delivers excellence in every product they create. This versatile device is perfect for a wide range of applications, offering fast propagation delay, standard input conditioning, and inverted output polarity. With a nominal supply voltage of 5V and a maximum seated height of just 4.44mm, this compact yet powerful component is a must-have for your electronic projects. Trust Onsemi to bring you the best in electronics technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity and reliability of the product.

Propagation Delay At Nominal Supply: 45 ns

Fast propagation delay allows for quick processing of signals, ideal for applications requiring rapid response times.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in harsh environments or applications that generate heat.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers MC74HCT138ANG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HCT138ANG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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