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MC74HC541ADTR2

Onsemi

MC74HC541ADTR2 by Onsemi

MC74HC541ADTR2 by Onsemi is an 8-bit bus driver with 28ns propagation delay, operating at 3V. It features a small outline package and can handle up to 6A output current. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,508 parts In-Stock

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Digiode

USA . 418 parts In-Stock

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AZTECH Wire

Italy . 186 parts In-Stock

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GreenTree Electronics

Israel . 60,000 parts In-Stock

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Kulean Microsystems

USA . 7,404 parts In-Stock

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Problanco Electronics

Mexico . 4,680 parts In-Stock

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SupplyDigital Components

Austria . 4,274 parts In-Stock

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Perfect Parts

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Corphita

USA . 1,525 parts In-Stock

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TANS Electronics

Latvia . 1,108 parts In-Stock

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Corohmni

South Africa . 422 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 258 parts In-Stock

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Overview

Experience the exceptional quality and reliability of the MC74HC541ADTR2 by Onsemi, a leading manufacturer in the industry. This bus driver & transceiver offers seamless integration and high performance for a wide range of applications. With a nominal supply voltage of 3V and a propagation delay of just 28ns, this product provides fast and efficient data transmission. Trust Onsemi to deliver top-notch products that exceed expectations and elevate your projects to new heights. Upgrade your systems with the MC74HC541ADTR2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, making it reliable for long-term use.

Propagation Delay At Nominal Supply: 28 ns

Fast propagation delay ensures quick signal transmission, which is essential for efficient communication in bus systems.

Surface Mount: YES

Surface mount capability makes installation easy and convenient, saving time and effort during the assembly process.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage of 3V, making it compatible with a wide range of bus systems and power supplies.

Load Capacitance (CL): 50 pF

Designed to work with a load capacitance of 50 pF, ensuring stable and efficient signal transmission in bus applications.

Output Characteristics: 3-STATE

3-state output allows for high flexibility and control over the bus signals, enabling efficient communication within the bus network.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the bus driver & transceiver energy-efficient and reliable.

Control Type: ENABLE LOW

Enable low control type provides a simple and effective way to activate or deactivate the bus driver & transceiver, enhancing the overall functionality of the device.

Technical Specifications

Bus Driver & Transceivers MC74HC541ADTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74HC541ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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