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MC74HC4046BDTR2G

Onsemi

MC74HC4046BDTR2G by Onsemi

MC74HC4046BDTR2G by Onsemi is a Phase Locked Loop (PLL) IC with 16 terminals, operating voltage range of 2-6V, and low supply current of 0.16mA. It is ideal for frequency synthesis circuits in military-grade applications due to its wide temperature range (-55 to 125 °C) and compact package design (5x4.4mm).

Median Price

$0.245

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,234 parts In-Stock

1+ parts

$0.245

100+ parts

$0.231

1k+ parts

$0.208

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3,234

$0.245

$0.231

$0.208

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Flip Electronics (Authorized)

USA . 10 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 842 parts In-Stock

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$0.233

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842

$0.233

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Vyrian

USA . 4,375 parts In-Stock

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4,375

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Chip Stock

USA . 228 parts In-Stock

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228

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Flip Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corphita

USA . 2,329 parts In-Stock

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$0.220

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2,329

$0.220

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Corohmni

South Africa . 283 parts In-Stock

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$0.245

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283

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Microchip USA

USA . 7,111 parts In-Stock

1+ parts

$1.680

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7,111

$1.680

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AZTECH Wire

Italy . 697 parts In-Stock

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$9.760

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697

$9.760

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Kulean Microsystems

USA . 5,945 parts In-Stock

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Problanco Electronics

Mexico . 4,036 parts In-Stock

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SupplyDigital Components

Austria . 1,290 parts In-Stock

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UHIMA Technologies

Türkiye . 790 parts In-Stock

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TANS Electronics

Latvia . 130 parts In-Stock

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Overview

Experience superior performance and reliability with the MC74HC4046BDTR2G by Onsemi, a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits. This versatile product offers precise frequency control and synchronization for your electronic devices, ensuring optimal functionality and efficiency. With a compact design and advanced technology, this product is perfect for a wide range of applications. Trust Onsemi to deliver top-quality components that exceed expectations and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and components.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the product.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC74HC4046BDTR2G attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

MC74HC4046BDTR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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