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MC74HC374ADTG

Onsemi

MC74HC374ADTG by Onsemi

MC74HC374ADTG by Onsemi is an 8-bit bus driver with 3-state output. It operates at a supply voltage of 2-6V, has a propagation delay of 190ns, and can handle load capacitance of 50pF. Ideal for applications requiring fast data transfer and low power consumption in military-grade environments.

Median Price

$0.379

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

2,250

-

$0.357

$0.296

$0.264

Verical

USA . 2,025 parts In-Stock

1+ parts

-

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$0.401

10k+ parts

$0.370

2,025

-

-

$0.401

$0.370

Distributors (In-Stock)

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Digiode

USA . 1,208 parts In-Stock

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$0.291

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$0.291

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Vyrian

USA . 8,101 parts In-Stock

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DigiKey Marketplace

USA . 2,250 parts In-Stock

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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Ashlea Components Ltd

UK . 6 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,102 parts In-Stock

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$0.275

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$0.275

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Corohmni

South Africa . 321 parts In-Stock

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$0.293

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321

$0.293

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AZTECH Wire

Italy . 1,132 parts In-Stock

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$12.020

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Perfect Parts

USA . 17,035 parts In-Stock

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SupplyDigital Components

Austria . 5,380 parts In-Stock

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Microchip USA

USA . 4,906 parts In-Stock

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Andel Nordic

Denmark . 3,816 parts In-Stock

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Kulean Microsystems

USA . 3,638 parts In-Stock

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TANS Electronics

Latvia . 3,495 parts In-Stock

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Problanco Electronics

Mexico . 2,985 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,250 parts In-Stock

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$0.260

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UHIMA Technologies

Türkiye . 215 parts In-Stock

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Overview

Enhance your electronic designs with the MC74HC374ADTG by Onsemi, a top-quality bus driver & transceiver that offers reliability and efficiency. Onsemi, a renowned manufacturer in the industry, delivers cutting-edge technology to meet your needs. This versatile component is ideal for a wide range of applications, providing seamless integration and superior performance. With its advanced features and high-quality construction, the MC74HC374ADTG ensures optimal functionality and longevity. Elevate your projects with this exceptional product and experience the benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards.

No. of Bits: 8

Provides a high level of accuracy and precision in data transmission.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard voltage, reducing energy consumption.

Output Characteristics: 3-STATE

Allows for the output to be in one of three states - high, low, or high-impedance, providing flexibility in the signal output.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, making it suitable for a variety of applications.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, enhancing performance and reliability.

Technical Specifications

Bus Driver & Transceivers MC74HC374ADTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

MC74HC374ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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