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MC74HC245ADTR2

Onsemi

MC74HC245ADTR2 by Onsemi

MC74HC245ADTR2 by Onsemi is an 8-bit bus driver with 22ns propagation delay, operating at a supply voltage of 3V. It features a small outline package, true output polarity, and dual terminal position. Ideal for bidirectional control applications in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,649 parts In-Stock

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Digiode

USA . 2,478 parts In-Stock

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Inland Empire Components Inc.

USA . 1,495 parts In-Stock

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1,495

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AZTECH Wire

Italy . 697 parts In-Stock

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$8.670

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697

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QUARKTWIN TECHNOLOGY LTD

USA . 22,341 parts In-Stock

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SupplyDigital Components

Austria . 8,235 parts In-Stock

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TANS Electronics

Latvia . 7,644 parts In-Stock

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Kulean Microsystems

USA . 6,595 parts In-Stock

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Problanco Electronics

Mexico . 4,813 parts In-Stock

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Microchip USA

USA . 3,082 parts In-Stock

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Corphita

USA . 411 parts In-Stock

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UHIMA Technologies

Türkiye . 293 parts In-Stock

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Corohmni

South Africa . 126 parts In-Stock

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Overview

Experience seamless data transmission with the MC74HC245ADTR2 by Onsemi, a high-quality bus driver & transceiver. Onsemi's reputation for excellence ensures reliability and performance in every application. This versatile product offers customers value by providing fast propagation delay, low power consumption, and 3-state output characteristics. Whether you're designing automotive electronics, industrial controls, or consumer devices, this compact and efficient solution will elevate your projects to the next level. Trust Onsemi to deliver cutting-edge technology that meets your needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the transceiver, making it easier to handle and less prone to damage during installation or use.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast data transmission, making this transceiver ideal for high-speed bus communication applications.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, ensuring compatibility with most systems and power sources.

Output Characteristics: 3-STATE

Allows the output to be in a high-impedance state, providing flexibility in controlling the bus line and reducing the chance of signal conflicts.

Temperature Grade: MILITARY

Designed to meet strict military specifications for reliability and performance in harsh environments, making it a rugged and dependable choice.

Technology: CMOS

Uses CMOS technology, which offers low power consumption, high noise immunity, and faster switching speeds, making it an efficient and reliable choice for bus driver applications.

Technical Specifications

Bus Driver & Transceivers MC74HC245ADTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

4.4 mm

Trade Compliance

MC74HC245ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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